| CVD & Sputtering |
|
| • | TEL 'Unity-EP' 2 & 3 chamber, TiN (Qty 6) |
| • | Applied Materials 'Centura 5200' ,2, 3, & 4 chamber (Qty 6) |
| • | Applied Materials 'P 5000' 2, 3, & 4 chamber (Qty 9) |
| • | Novellus 'Concept 2 Altus' 2 chamber/CVD-W (to 2003) (Qty 2) |
| • | Applied Materials 'Endura 5500' 5 chamber (Qty 2) |
|
| Photolithography |
|
| • | Canon '5500 iZ' & '5500 iZ+' 365nm Stepper ( 2003/4) (Qty 3) |
| • | Nikon 'NSR 4425i' 365nm Stepper (Qty 3) |
| • | Sokudo (DNS) 'RF -300A' & 'RF-310A' coaters / developers 300mm capability (2007/8) (Qty 3) |
| • | TEL 'CleanTrack ACT-8' & 'Mark-8' 2 coater / developers (Qty 12) |
|
| Implanters |
|
| • | Sumitomo 'LEX' Batch type high current implanter (to 2007) (Qty 5) |
| • | Sumitomo 'NV-GSDIII-90/90LE' low energy implanter (to 2002) |
|
| Etching |
|
| • | LAM '2300' Versys & Exelan 300mm capable 4 chamber (2003) |
| • | LAM 'TCP 9600SE' Metal Etch/Microwave Asher (Qty 5) |
| • | LAM 'Rainbow 4400' Nitride (Qty 5) |
| • | TEL 'Unity2e-855DD' & 'Unity -Version II 85D' 2 chamber (Qty 17) |
| • | Applied Materials 'Centura 5200' & ‘P5000’ (to 2000) (Qty 22) |
|
| Metrology |
|
| • | Applied Materials 'Nanosem' CD SEM ( to 2006) (Qty 2) |
| • | Applied Materials 'Verasem - 3D' SEM (to 2004) (Qty 5) |
| • | Applied Materials 'Verity' SEM (2007) (Qty 1) |
| • | Hitachi 'S-9220', 'HD 2000' & 'S 4500' SEM (Qty 3) |
| • | NOVA 'Nova Scan 3060CD' (2005) |
|
| Also Wet Chemistry, Test and Wafer Handling and Transfer |
|
