NanoLab@TU/e orders Trymax plasma system for resist stripping, descum and surface cleaning on InP

Trymax Semiconductor Equipment BV of Nijmegen, The Netherlands (which provides plasma-based solutions for photoresist removal, surface cleaning, isotropic etch and UV curing/charge erase) says that Eindhoven University of Technology’s NanoLab@TU/e has ordered a NEO 200A system with microwave downstream plasma technology (for installation in third-quarter 2019) for resist stripping, descum and surface cleaning on indium phosphide (InP) wafers. Trymax claims that the order illustrates the competitiveness of its single chamber and fully automated solution for the photonics market.

“European research organizations and equipment companies are at the forefront of the global photonics industry,” comments Carlos Lee, director general of the European Photonics Industry Consortium (EPIC). “Having a company such as Trymax collaborating with Eindhoven University of Technology goes in the right direction to build an efficient manufacturing infrastructure.”

Eindhoven University of Technology selected Trymax after running technical demonstrations on InP substrate and other compound semiconductor substrates. The results achieved on the NEO 200A platform in terms of ash rate, non-uniformity and handling of critical substrate materials of different sizes are said to have outperformed competing solutions.

“Beyond silicon, Trymax has a long experience and unique capabilities in handling various substrates materials such as SiC, GaN, GaAs, LiNbO3, LiTaO3, glass and eWLB,” says CEO Leo Meijer.

“Eindhoven University of Technology has chosen the Trymax NEO 200A because of the robustness of the tool, the expertise of the Trymax team and the short distance to the lab, all of which is superior to what we found elsewhere on the market,” comments NanoLab@TU/e’s managing director Huub Ambrosius.

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Tags: Plasma etch

Visit: www.trymax-semiconductor.com