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14 July 2008


TriQuint ramps production of TQM7M5012

RF front-end manufacturer TriQuint Semiconductor Inc of Hillsboro, OR, USA has announced that more than 15 customers have chosen its TQM7M5012, a 5x5mm Polar EDGE Power Amplifier Module (PAM) for forthcoming 3G handsets.

The TQM7M5012 is a third generation PAM and part of TriQuint’s Hadron II PA-Module product range. It is built with TriQuint’s patented CuFlip technology, a packaging technique that enables a more compact solution. When paired with an industry standard-WEDGE front-end module, the total solution is smaller, uses fewer components and is less expensive compared to existing solutions on the market, says TriQuint.

“Our flip-chip technology enables an incredibly small form factor and superior electrical performance, helping customers to utilize precious board space for rich features while optimizing battery utilization. Customers are impressed with the elegant design of the TQM7M5012; TriQuint is seeing significant demand from a diverse customer base,” says TriQuint’s product marketing manager, Stuart Laval.

See related items:

TriQuint lowers Q2 guidance from $130-135m to $120m

TriQuint’s profits hit by military/network R&D costs

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