HoribaHoriba
12 September 2024

JEDEC publishes test method for addressing switching energy loss associated with output capacitance hysteresis

Document applies to both wide-bandgap and silicon power devices

11 September 2024

Infineon pilots first 300mm power GaN wafer technology on existing large-scale 300mm silicon line

300mm gallium nitride to help achieve cost parity with silicon

10 September 2024

Soitec kicks off European project Move2THz to develop future high-frequency InP-based semiconductors

Applications span photonics for mega data centers and AI to RF front-ends and integrated antennas for 6G mobile communication and sub-THz radar sensing

10 September 2024

Broadcom producing RF FEMs for Wi-Fi 7 mobile based on Tower’s 300mm RFSOI

Technology delivers enhanced mobile connectivity performance and efficiency

10 September 2024

GlobalFoundries joins Silicon Catalyst as partner to speed start-ups’ technology development

GF joins incubator’s ecosystem as both a strategic and in-kind partner

10 September 2024

Wolfspeed unveils 2300V baseplate-less SiC power modules for 1500V DC bus applications

Partnership formed with utility-scale inverter manufacturer EPC Power

9 September 2024

ROHM and UAES sign long-term supply agreement for SiC power devices

Firms deepen collaboration, accelerating development of SiC power solutions for EVs

9 September 2024

Shin-Etsu Chemical to develop QST substrate for 300mm GaN

Existing 150mm and 200mm QST substrate range extended to 300mm

5 September 2024

Applied Ventures and ITIC-Taiwan join Wise-integration’s Series B funding round

AVITIC adds to €15m raised February

5 September 2024
DBR-free thin-film InGaN VCSELs
Device achieves lasing without lateral confinement under optical pumping.
5 September 2024

NUBURU partners with Ohio State’s CDME to showcase blue lasers in additive manufacturing

BlueScan technology to be installed in powder bed fusion system

4 September 2024

Japan’s NCT gains NEDO funding for project to develop β- Ga2O3 wafers, power devices and power modules

Novel Crystal Technology collaborating with Mitsubishi Electric and Japan Fine Ceramics Center

Bruker
AFC Industries
Vistec
Pfeiffer Vacuum
ETA Research
News Features
29 August 2024
Micro-LEDs on freestanding GaN
Optimized MQW increased external quantum efficiency from 7.9% to 14.8% at 10A/cm2 injection.
23 August 2024
High-current vertical diamond MOSFETs
Researchers achieve drain currents above 1A by connecting two devices.
9 August 2024
Red/yellow InGaN micro-LED photodetectors for visual light communications
Researchers demonstrate high-data-rate reception from white LED transmitters.
1 August 2024
Strain-engineering for green LEDs on silicon
Using single AlN buffer increased internal quantum efficiency from 33% to 78%.
24 July 2024
Nanoparticle-based zinc oxide homojunction LEDs
Nanoparticles provide hole injection into pn-junction.
18 July 2024
TMAl reflow GaN-on-silicon for fully vertical electronics
Avoiding intentional AlN buffer growth enables high current flow through GaN/Si interface.
Feature Downloads
2 September 2024

Fraunhofer IAF uses MOCVD to fabricate aluminum yttrium nitride
Alternative to magnetron sputtering of AlYN opens up commercial applications of AlYN/GaN heterostructures.

2 September 2024

Gallium nitride HEMTs on 8-inch sapphire
Researchers seek to reduce production costs for devices with blocking voltages beyond 1200V.

2 September 2024

Etching-free pixel definition for InGaN micro-LEDs
Selective thermal oxidation proposed as viable alternative to plasma etch.

2 September 2024

Red InGaN micro-LED on silicon prospecting
Pioneers reach ultra-high 4232PPI resolution.

2 September 2024

Near size-independent UV-A micro-LED performance
Researchers claim record for on-wafer EQE from sub-10μm device.

2 September 2024

Comparison between MBE and MOCVD technologies
Richard Hogg, III-V Epi chief technology officer and professor of Photonics at Aston Institute of Photonics Technology (AIPT), and Dr Neil Gerrard, III-V Epi director of epitaxy, explore the III-V semiconductor synthesis applications that each epitaxial growth technology best suits.

5 July 2024

InP-on-insulator substrates for 2.1μm lasers on silicon
Ion-slicing technique could enable lower-cost production of optoelectronics.

5 July 2024

PCSEL emits at more than 300mW CW at 1550nm wavelength
Potential applications include communications and eye-safe LiDAR.