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ClassOne secures record follow-on Solstice S8 orders from AOI
Wet processing systems to support expanding high-volume 6-inch InP photonics manufacturing for AI data centers
MIT Lincoln Lab buys Aixtron Hyperion 300mm MOCVD systems
Systems to be used for GaN power & RF device development and 2D materials research
AXT expands board from four to five directors
Tracy Liu to strengthen understanding of business environment in which Chinese subsidiary Tongmei operates
Nanjing-based Casela to buy $25.4m of InP wafers from AXT’s Tongmei during 2027
Half to be pre-paid; cancellation fee due if total purchased falls short of 80%
Elethron and ATMOS complete engineering collaboration on microgravity R&D and in-space production for advanced materials
Collaboration mapped and de-risked how Materials Lab integrates with PHOENIX return vehicle.
Aehr receives follow-on production order from silicon photonics customer
Fully automated wafer-level burn-in system to be used for hyperscale data-center optical interconnect applications
CSA Catapult appoints head of quantum
William Waller to help accelerate UK transition from research to deployable systems
JX expanding InP substrate production capacity again to meet data-center optical communications demand
Up to ¥120bn over four years takes total to ¥150bn
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