AES Semigas

Honeywell
24 June 2026

ClassOne secures record follow-on Solstice S8 orders from AOI

Wet processing systems to support expanding high-volume 6-inch InP photonics manufacturing for AI data centers

23 June 2026

MIT Lincoln Lab buys Aixtron Hyperion 300mm MOCVD systems

Systems to be used for GaN power & RF device development and 2D materials research

23 June 2026

AXT expands board from four to five directors

Tracy Liu to strengthen understanding of business environment in which Chinese subsidiary Tongmei operates

18 June 2026

Nanjing-based Casela to buy $25.4m of InP wafers from AXT’s Tongmei during 2027

Half to be pre-paid; cancellation fee due if total purchased falls short of 80%

18 June 2026

Elethron and ATMOS complete engineering collaboration on microgravity R&D and in-space production for advanced materials

Collaboration mapped and de-risked how Materials Lab integrates with PHOENIX return vehicle.

18 June 2026

Aehr receives follow-on production order from silicon photonics customer

Fully automated wafer-level burn-in system to be used for hyperscale data-center optical interconnect applications

17 June 2026

CSA Catapult appoints head of quantum

William Waller to help accelerate UK transition from research to deployable systems

17 June 2026

JX expanding InP substrate production capacity again to meet data-center optical communications demand

Up to ¥120bn over four years takes total to ¥150bn

CS Clean
Vistec

Microelectronics UK

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