AES Semigas

Honeywell
30 June 2026

US Critical Materials relocates HQ to Darby, Montana, and appoints new leadership

Sheep Creek Project website launched to engage with public

30 June 2026

Keysight and WIN collaborate to cut design risk for high-frequency RF components

New GaN MMIC design workflow reduces fabrication risk for 5G, satellite and defense applications

30 June 2026

Photon Design showcases industry-first simulation tools for quantum dot lasers and PCSELs at ISLC

First 3D dynamic QD simulations along with PCSEL design flow for dynamic gain FDTD

24 June 2026

ClassOne secures record follow-on Solstice S8 orders from AOI

Wet processing systems to support expanding high-volume 6-inch InP photonics manufacturing for AI data centers

23 June 2026

MIT Lincoln Lab buys Aixtron Hyperion 300mm MOCVD systems

Systems to be used for GaN power & RF device development and 2D materials research

23 June 2026

AXT expands board from four to five directors

Tracy Liu to strengthen understanding of business environment in which Chinese subsidiary Tongmei operates

18 June 2026

Nanjing-based Casela to buy $25.4m of InP wafers from AXT’s Tongmei during 2027

Half to be pre-paid; cancellation fee due if total purchased falls short of 80%

18 June 2026

Elethron and ATMOS complete engineering collaboration on microgravity R&D and in-space production for advanced materials

Collaboration mapped and de-risked how Materials Lab integrates with PHOENIX return vehicle.

CS Clean
Vistec

Microelectronics UK

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