Honeywell
6 November 2025

Ascent Solar and CisLunar team to bring longer-lasting power solutions to US space market

CIGS PV technology to be paired with high-efficiency power conversion technology

6 November 2025

Sivers details strategic partnership with POET to deliver light engines for AI infrastructure

Collaboration combines DFB lasers with Optical Interposer to deliver scalable, energy-efficient light sources

6 November 2025

Boise State selected for $1.5m DEPSCoR award for research on synthesizing GaN

Team to investigate impurities for enhancing GaN’s optical, electrical and thermal properties while improving radiation resistance

6 November 2025

BluGlass gives update on September-quarter activities and results

Received orders from Collins Aerospace and Infleqtion

5 November 2025

Infineon and SolarEdge collaborate on high-efficiency power infrastructure for AI data centers

Solid-state transformer to enable direct medium-voltage to 800–1500V DC conversion with over 99% efficiency, reducing size, weight and CO2 footprint

4 November 2025

MACOM agrees exclusive license to manufacture products based on HRL’s 40nm T3L GaN-on-SiC process

Firms to work on rapid transfer of process to MACOM foundry

3 November 2025

Micro-LED firm VueReal expanding presence in China market

Business development consultancy Intralink to engage display makers, automotive OEMs and tier-one suppliers

3 November 2025

Wolfspeed cuts quarterly loss after CapEx slashed during restructuring

Year-on-year revenue growth of 36% for Power Products counteracts decline for Materials Products

31 October 2025

Latest issue of Semiconductor Today now available

For coverage of all the key business and technology developments in compound semiconductors and advanced silicon materials and devices over the last month, see latest issue.

30 October 2025
P-type layer etch for enhanced deep UV LEDs
Researchers achieve 10.9% increased light output power.
30 October 2025

onsemi unveils vertical GaN power semiconductors, based on proprietary GaN-on-GaN technology

Both 700V and 1200V devices now sampling to early-access customers

30 October 2025

IVWorks implements mass production of 8-inch InGaN/GaN nanowire epiwafers

Development of 12-inch epiwafers being accelerated, targeting solar panels for artificial photosynthesis of hydrogen

Bruker
CS Clean
Vistec
News Features
23 October 2025
Benefits of hexagonal mesa for micro-LEDs
Devices demonstrate enhanced current diffusion and uniformity.
16 October 2025
Indium arsenide quantum dot laser full MBE on (100) silicon
V-grooves eliminate anti-phase boundaries and reduce threading dislocations.
9 October 2025
Electrochemical III-nitride device lift-off
Plotting a route to damage-free integration with diverse optoelectronic platforms.
2 October 2025
Quantum cascade lasers on a mid-infrared silicon photonic platform
Devices achieve 180K T0, comparable to state-of-the-art devices on native III-V substrates.
25 September 2025
MOCVD–MBE hybrid growth for green laser diodes
Lower growth temperature enabled by MBE eases thermal budget constraints.
11 September 2025
Boron nitride as a buffer and gate dielectric
GaN HEMTs demonstrate ultra-high ~1011 on/off current ratio.
Feature Downloads
3 October 2025

Boron nitride as a buffer and gate dielectric
Ultrawide-bandgap hexagonal boron nitride has been used to demonstrate AlGaN HEMTs with an ultra-high ~1011 on/off current ratio.

3 October 2025

Electrochemical III-nitride device lift-off
Plotting a route for the scalable, damage-free integration of III-nitrides onto diverse platforms for optoelectronic applications.

3 October 2025

MOCVD–MBE hybrid growth for green laser diodes
The lower growth temperature enabled by the use of MBE eases thermal budget constraints.

3 October 2025

Indium arsenide quantum dot laser full MBE on (100) silicon
V-grooves eliminate anti-phase boundaries and reduce threading dislocations.

3 October 2025

Quantum cascade lasers on a mid-infrared silicon photonic platform
Devices have achieved a T0 characteristic temperature of 180K, comparable to state-of-the-art devices on native III-V substrates.

22 September 2025

Foundry fabricated AlN-buffer HEMTs
Significant step towards industrial AlN/GaN/AlN transistors.

22 September 2025

Laser transfer of blue micro-LED arrays
Researchers in Shanghai have used rubber tape as a device carrier before thermo-compression bonding of the flipped chip array to the target substrate.

22 September 2025

University of Glasgow reports single-chip laser system with 983Hz linewidth
A topological interface state extended laser with optical injection locking has been integrated on an indium phosphide substrate.