Honeywell
13 November 2025
Inverting Ga-polar LEDs for N-polar benefit
Structure enables around 1000x light output over comparable N-polar LED.
13 November 2025

CSconnected announces £1m third call to Supply Chain Development Programme

Grants available up to £100,000, or £30,000 for micro-companies

13 November 2025

Tower extends 300mm wafer bonding technology across SiPho and SiGe BiCMOS

Wafer-scale 3D-IC technology unlocks integration of SiPho and EIC processes for emerging applications such as co-packaged optics

13 November 2025

Ascent Solar and NovaSpark to team on lightweight power solutions for drones and terrestrial defense applications

CIGS PVs to be packaged with mobile hydrogen generation systems

12 November 2025

CreeLED sues Promier Products and Tractor Supply

Portable lighting products alleged to infringe patents

12 November 2025

SK keyfoundry accelerating development of SiC-based power semiconductor technology

Core silicon carbide processes and design technologies secured via acquisition of SK powertech

12 November 2025

RPI-led team demonstrates remote epitaxy with 2–7nm epilayer–substrate distance

Defect-assisted, long-range remote electrostatic interactions enable nucleation and alignment in crystal films

10 November 2025

GlobalFoundries licenses TSMC’s 650V and 80V GaN technology

US-made power products to be available in late 2026, targeting data-center, industrial and automotive applications

10 November 2025

AXT’s Q3 revenue far exceeds guidance, after China export licenses granted for InP

Demand booming from data centers, but licensing constraining shipments while order backlog climbs

10 November 2025

HKUST develops record-efficiency red quantum rod LEDs

Peak EQEs of 31% for red QR-LEDs and 20.2% for green dot-in-rod QRs

10 November 2025

Navitas announces private placement of common stock for proceeds of $100m

Raised capital to accelerate transformation into high-power markets

7 November 2025

Aixtron’s Q3 revenue and margin impacted by volume shifts into Q4

Strong free cash flow generation continues, driven by working capital optimization and cut in CapEx

Bruker
CS Clean
Vistec
News Features
30 October 2025
P-type layer etch for enhanced deep UV LEDs
Researchers achieve 10.9% increased light output power.
23 October 2025
Benefits of hexagonal mesa for micro-LEDs
Devices demonstrate enhanced current diffusion and uniformity.
16 October 2025
Indium arsenide quantum dot laser full MBE on (100) silicon
V-grooves eliminate anti-phase boundaries and reduce threading dislocations.
9 October 2025
Electrochemical III-nitride device lift-off
Plotting a route to damage-free integration with diverse optoelectronic platforms.
2 October 2025
Quantum cascade lasers on a mid-infrared silicon photonic platform
Devices achieve 180K T0, comparable to state-of-the-art devices on native III-V substrates.
25 September 2025
MOCVD–MBE hybrid growth for green laser diodes
Lower growth temperature enabled by MBE eases thermal budget constraints.
Feature Downloads
12 November 2025

Hidden powerhouse: South Wales, at the heart of the global compound semiconductor industry
Howard Rupprecht, managing director of CSconnected, highlights the global role of the South Wales-based compound semiconductor cluster.

3 October 2025

Boron nitride as a buffer and gate dielectric
Ultrawide-bandgap hexagonal boron nitride has been used to demonstrate AlGaN HEMTs with an ultra-high ~1011 on/off current ratio.

3 October 2025

Electrochemical III-nitride device lift-off
Plotting a route for the scalable, damage-free integration of III-nitrides onto diverse platforms for optoelectronic applications.

3 October 2025

MOCVD–MBE hybrid growth for green laser diodes
The lower growth temperature enabled by the use of MBE eases thermal budget constraints.

3 October 2025

Indium arsenide quantum dot laser full MBE on (100) silicon
V-grooves eliminate anti-phase boundaries and reduce threading dislocations.

3 October 2025

Quantum cascade lasers on a mid-infrared silicon photonic platform
Devices have achieved a T0 characteristic temperature of 180K, comparable to state-of-the-art devices on native III-V substrates.

22 September 2025

Foundry fabricated AlN-buffer HEMTs
Significant step towards industrial AlN/GaN/AlN transistors.

22 September 2025

Laser transfer of blue micro-LED arrays
Researchers in Shanghai have used rubber tape as a device carrier before thermo-compression bonding of the flipped chip array to the target substrate.