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Honeywell
1 July 2026

Dynex introduces 450A, 650V GaN half-bridge power module

Planar PCB embedding technology minimizes parasitic inductance, and double-sided-cooled planar package structure minimizes thermal resistance

30 June 2026

Gartner names Infineon as company to beat in AI data-center power semiconductors

Position being tested by growing competition in SiC and GaN

30 June 2026

Infineon introduces 120V common-footprint gate driver for silicon and GaN power designs on the same PCB

EiceDRIVER 2EDL90xG3 supports 48V and high-voltage intermediate bus converter applications in AI data-center servers

29 June 2026

Paragraf forms Advisory Committee and adds to board of directors

Firm aims to scale production, expand internationally and integrate into global electronics manufacturing ecosystem

29 June 2026

Infineon introduces first 24kW SiC-based battery backup unit reference design for high-voltage DC bus architectures in AI data centers

Power density of 450W/in3 and efficiency over 99% in form factor of low-voltage BBUs

29 June 2026

Infineon adds two new high-efficiency server power solutions for AI data-center PSUs

18kW PSU reference design for 50V rack architecture, and 30kW interleaved T-Type PFC evaluation board for 800VDC or ±400VDC rack architectures with power sidecar

26 June 2026

Infineon expands CoolSiC JFET portfolio with normally-off variants for AI data centers and industrial applications

CoolSiC JFET 750V and 1200V in Q-DPAK entering mass production, as engineering samples of TO-247-4, Dual Drive and Cascode configurations made available

26 June 2026

Infineon launches EasyPACK S module and packaging concept

Compact designs target higher power densities in space-constrained environments

Bruker
LayTec

Microelectronics UK

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