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Honeywell
29 June 2026

Paragraf forms Advisory Committee and adds to board of directors

Firm aims to scale production, expand internationally and integrate into global electronics manufacturing ecosystem

29 June 2026

Infineon introduces first 24kW SiC-based battery backup unit reference design for high-voltage DC bus architectures in AI data centers

Power density of 450W/in3 and efficiency over 99% in form factor of low-voltage BBUs

29 June 2026

Infineon adds two new high-efficiency server power solutions for AI data-center PSUs

18kW PSU reference design for 50V rack architecture, and 30kW interleaved T-Type PFC evaluation board for 800VDC or ±400VDC rack architectures with power sidecar

26 June 2026

Infineon expands CoolSiC JFET portfolio with normally-off variants for AI data centers and industrial applications

CoolSiC JFET 750V and 1200V in Q-DPAK entering mass production, as engineering samples of TO-247-4, Dual Drive and Cascode configurations made available

26 June 2026

Infineon launches EasyPACK S module and packaging concept

Compact designs target higher power densities in space-constrained environments

26 June 2026

Infineon sampling silicon carbide bidirectional switch based on 750V CoolSiC G2 technology

Vertically integrated dual-die with common drain in top-side-cooled Q-DPAK package integrates two power switches

26 June 2026

Infineon sampling H-DPAK addition to top-side-cooling package family

Integrated half-bridge devices in 750V CoolSiC G2 technology boost system density and reliability

26 June 2026

Baylin wins purchase orders totalling over CDN$9m for Genesis amplifiers

Genesis C- and Ku-band SSPAs span 200–500W

Bruker
LayTec

Microelectronics UK

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