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Soitec and NTU Singapore reporting results of research program into 6G connectivity
Power-added efficiency exceeds 50% at FR3 frequencies
EPC highlights Gen 7 GaN for AI infrastructure and GaN ICs for robotics at APEC
Enabling scalable power for AI computing and next-generation robotics
Navitas exhibiting solutions for AI data-center, grid and energy infrastructure, performance computing, and industrial electrification
Product and system highlights include latest AI data-center solutions including a 10kW ‘GaN-powered’ 800V–50V brick, ultra-high-voltage SiC, SiCPAK modules, and 650V & 100V GaNFast power devices.
Infineon adds to CoolGaN Drive HB 600V G5 product family
Four new devices integrate two 600V GaN switches in half-bridge configuration with high- and low-side gate drivers and bootstrap diode
UCSB’s James Buckwalter inducted as senior member of the US National Academy of Inventors
Honored for work on high-speed and high-frequency ICs integrating CMOS with III-Vs
ROHM licenses TSMC’s GaN processs technology for Hamamatsu fab
End-to-end, in-house production from 2027 to meet demand for applications such as AI servers and EVs
EPC adds 3-phase BLDC motor drive inverter evaluation board for humanoid robot joint applications
Integrated GaN power stage with onboard control, sensing and communication delivers up to 20ARMS in a 32mm circular design
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