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Infineon expands CoolSiC JFET portfolio with normally-off variants for AI data centers and industrial applications
CoolSiC JFET 750V and 1200V in Q-DPAK entering mass production, as engineering samples of TO-247-4, Dual Drive and Cascode configurations made available
Infineon launches EasyPACK S module and packaging concept
Compact designs target higher power densities in space-constrained environments
Infineon sampling silicon carbide bidirectional switch based on 750V CoolSiC G2 technology
Vertically integrated dual-die with common drain in top-side-cooled Q-DPAK package integrates two power switches
Infineon sampling H-DPAK addition to top-side-cooling package family
Integrated half-bridge devices in 750V CoolSiC G2 technology boost system density and reliability
Baylin wins purchase orders totalling over CDN$9m for Genesis amplifiers
Genesis C- and Ku-band SSPAs span 200–500W
Eggtronic introduces 500W solar microinverter reference platform with Renesas
Single-stage, high-frequency GaN architecture with 96.1% CEC efficiency and optimized BOM cost
Infineon’s GaN technology boosts efficiency and power density in BRC Solar’s Power Optimizer
CoolGaN Transistor 100V devices providing core switching technology
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