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STMicroelectronics launches GaNSPIN system-in-package family
GaN ICs tailored for motor drives in white goods and factory automation
PowerAmerica issues request for proposals for 24-month projects
Projects to develop wide-bandgap power semiconductor technologies, power electronics assemblies, and packaging and manufacturing processes
GlobalFoundries and Navitas partner on US GaN technology and manufacturing
Partnership expands US capacity for GaN technology, design and at-scale manufacturing for AI data centers and critical power applications
onsemi authorizes $6bn share repurchase program
New program doubles prior share repurchase authorization
Filtronic completes multi-year project to develop plastic QFN packaging for GaN devices
Projects strengthens UK’s independence in critical semiconductor technology for defence, space and communication systems
Wolfspeed launches 1200V silicon carbide six-pack power modules for E-mobility propulsion systems
Gen 4 power modules deliver 3x power cycling capability and 15% higher current capability
University of Arkansas opens Multi-User Silicon Carbide Facility
MUSiC to provide open-access domestic opportunities for prototyping, proof-of-principle demos and device design
imec achieves record GaN breakdown exceeding 650V on Shin-Etsu Chemical’s 300mm QST substrate
650V-rated HEMT to be followed by 1200V+ variant, targeting AI data-center, industrial and automobile applications
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