AES Semigas

Honeywell
28 September 2026

Fraunhofer IAF develops broadband distributed amplifier MMIC for data centers, measurement systems and sensors

InGaAs-on-silicon HEMT with gate-length of 20nm enables 11 ± 2dB gain at 4–420GHz

28 September 2026

Wise Integration’s digital control technology to combine with Navitas’ wide-bandgap technologies

Collaboration to advance performance computing applications for AI PCs, high-end workstations, gaming desktops and industrial systems

25 September 2026

Toshiba launches 3300V SiC MOSFET module

High-surge-current capability helps to improve industrial equipment reliability

24 September 2026

Qorvo achieves key X-band GaN milestone in DARPA THREADS program

Results at end of DARPA THREADS program’s Phase I precedes follow-on work in Phase 2

18 September 2026

onsemi unveils Embedded Power Platform

Architecture uses silicon wafer as package and introduces highly integrated approach to power system design

17 September 2026

ROHM’s silicon carbide used in electric powertrain of BMW’s ‘Neue Klasse’ Gen 6 EVs

SiC MOSFETs boost driving range, charging performance, and energy efficiency

15 September 2026

Altum RF showcasing products and expertise at EuMW

E-band family of power amplifiers and low-noise amplifiers highlighted at European Microwave Week

15 September 2026

EPC issues white papers on GaN power conversion for AI data centers and advanced motor drives

Papers examine 800VDC power delivery for AI infrastructure and integrated 100V GaN power stages for robotics, drones, and precision motion control

Bruker
LayTec

Microelectronics UK

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