AES Semigas

Honeywell
20 July 2026

Jilin University achieves record 2DEG mobility for N-polar GaN/AlGaN heterostructures on SiC

Reducing high-resistance GaN template MOCVD growth temperature increases carbon incorporation and reduces oxygen concentration

16 July 2026

Bosch gains $225m US CHIPS funding for $2bn transformation of Roseville fab for SiC production

Sample production begun, prior to first commercial chips on 200mm wafers this year

16 July 2026

WeEn launches 1200–2300V silicon carbide power modules

WMSC family offers enhanced efficiency, reliability and flexibility for PFC and DC–DC SSTs applications

15 July 2026

NextGO Epi raises €2m in pre-seed funding

Europe’s only gallium oxide semiconductor producer to accelerate product development, grow team, and strengthen commercial presence

15 July 2026

Infineon introduces rad-hard GaN HEMT driver

RIC70115 targeted at satellite and hi-rel space applications

15 July 2026

EPC showcasing GaN power innovation at Tech Taipei Power 2026

Industry keynote highlights AI-driven power trends, 800VDC architectures, and GaN innovation

9 July 2026

Navitas refutes Wolfspeed’s allegations of patent infringement

Firm will “vigorously defend itself and its products”

8 July 2026

PVA TePla and Fraunhofer IISB establish Joint Lab for aluminium nitride substrates

Small-batch production of 2-inch monocrystalline AlN for R&D to precede 4- and 6-inch

Bruker
LayTec

Microelectronics UK

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