AES Semigas

Honeywell
26 June 2026

Infineon expands CoolSiC JFET portfolio with normally-off variants for AI data centers and industrial applications

CoolSiC JFET 750V and 1200V in Q-DPAK entering mass production, as engineering samples of TO-247-4, Dual Drive and Cascode configurations made available

26 June 2026

Infineon launches EasyPACK S module and packaging concept

Compact designs target higher power densities in space-constrained environments

26 June 2026

Infineon sampling silicon carbide bidirectional switch based on 750V CoolSiC G2 technology

Vertically integrated dual-die with common drain in top-side-cooled Q-DPAK package integrates two power switches

26 June 2026

Infineon sampling H-DPAK addition to top-side-cooling package family

Integrated half-bridge devices in 750V CoolSiC G2 technology boost system density and reliability

26 June 2026

Baylin wins purchase orders totalling over CDN$9m for Genesis amplifiers

Genesis C- and Ku-band SSPAs span 200–500W

24 June 2026

Eggtronic introduces 500W solar microinverter reference platform with Renesas

Single-stage, high-frequency GaN architecture with 96.1% CEC efficiency and optimized BOM cost

24 June 2026

Infineon’s GaN technology boosts efficiency and power density in BRC Solar’s Power Optimizer

CoolGaN Transistor 100V devices providing core switching technology

23 June 2026
Increasing passivated AlGaN power
Researchers report 1.7x Baliga figure-of-merit enhancement for transistor on sapphire substrate.
Bruker
LayTec

Microelectronics UK

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