AES Semigas

Honeywell
13 August 2026
Electrochemical GaN HEMT exfoliation

Silicon substrate release method results in less than 2nm roughness of etched surfaces.

13 August 2026

BAE Systems advances to Phase 2 of DARPA’s THREADS program

Technologies for Heat Removal in Electronics at the Device Scale addressing temperature limitations in advanced RF electronics

11 August 2026

Soctera raises $4m in seed funding round

Funds to aid development of thermally optimized III-nitride millimeter-wave power amplifiers

11 August 2026

Navitas files patent infringement lawsuit against Renesas

Renesas’ major GaN product lines alleged to infringe four Navitas patents

7 August 2026
GaN HEMT short-circuit performance

Device achieves record 629μs withstanding time.

6 August 2026

Wolfspeed and LITEON partner on 800VDC power solutions for hyperscale AI data centers

Wolfspeed’s silicon carbide technology to be deployed in LITEON’s 800VDC power sidecar and compute rack PSU platforms

6 August 2026
Taking heat off AlGaN-channel HEMTs
Researchers report record thermal performance
6 August 2026

Skyworks’ Mobile revenue drop offset by automotive and data-center growth

New capital allocation framework and $2bn debt financing to support Qorvo merger

Bruker
LayTec

Microelectronics UK

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