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Silicon substrate release method results in less than 2nm roughness of etched surfaces.
BAE Systems advances to Phase 2 of DARPA’s THREADS program
Technologies for Heat Removal in Electronics at the Device Scale addressing temperature limitations in advanced RF electronics
Soctera raises $4m in seed funding round
Funds to aid development of thermally optimized III-nitride millimeter-wave power amplifiers
Navitas files patent infringement lawsuit against Renesas
Renesas’ major GaN product lines alleged to infringe four Navitas patents
Device achieves record 629μs withstanding time.
Wolfspeed and LITEON partner on 800VDC power solutions for hyperscale AI data centers
Wolfspeed’s silicon carbide technology to be deployed in LITEON’s 800VDC power sidecar and compute rack PSU platforms
Skyworks’ Mobile revenue drop offset by automotive and data-center growth
New capital allocation framework and $2bn debt financing to support Qorvo merger
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