AES Semigas

Honeywell
17 April 2025

Navitas’ new 1200V SiCPAK power modules enable high reliability and efficient high-temperature performance

Low-cost epoxy-resin potting enables 5x lower thermal resistance increase for extended system lifetime

17 April 2025

ROHM highlighting e-mobility and industrial applications at PCIM 2025

Showcasing reference projects with partners and presenting evolution of package designs and evaluation boards

17 April 2025

UIUC reports record switching performance in intrinsic diamond photoconductive semiconductor switches

Record voltage/current handling and slew rates, efficiency and reliability simultaneously enables a step towards Megawatt-power nanosecond switching

16 April 2025

Polar to license Renesas’ GaN-on-Si technology and onshore commercial fabrication of 650V-class devices on 200mm wafers

Partnership strengthens domestic supply chain and enhances access of dual-use technology to US customer base

16 April 2025

Navitas gains automotive qualification of high-power GaNSafe ICs

AEC-Q100 for packaged integrated circuits and AEC-Q101 for discrete semiconductors qualify both discrete power FET stage and combined IC solution

16 April 2025

Toshiba showcasing wide-bandgap technology at PCIM

Updates on advances in 6-inch silicon carbide

16 April 2025

Diodes Inc adds 650V SiC Schottky diodes with low figure-of-merit

Compact, low-profile T-DFN8080-4 surface-mount package incorporates large underside heat pad, reducing thermal resistance

15 April 2025

ST reshaping manufacturing footprint to invest in 300mm silicon, 200mm SiC, and technology R&D

Program, including resizing global cost base, to shed 2800 staff over three years

Bruker
LayTec

Book This Space