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GE Aerospace and Wolfspeed sign MoU to collaborate on accelerating high-voltage silicon carbide adoption
Wolfspeed to supply 10kV MOSFET die and jointly determine standard high-voltage power module formats
onsemi introduces Elite Pairing Studio to simplify pairing SiC MOSFETs and gate drivers for power electronics design
Online interactive simulation tool gives visibility into device-level behavior and pairing trade-offs
Infineon’s silicon carbide power modules to be used in Siemens’ semiconductor circuit breakers
Enhancing efficiency, power density and reliability of electrical protection in data centers, factories and battery storage systems
Fraunhofer IAF presents innovations at PCIM
1200V GaN-based power electronics module used in demonstrator of bidirectional, single-phase 800V DC off-board EV charging system
QPT unveils AI-driven design service for optimizing thermal interface layer
Automating generate-simulate-iterate loop cuts die attach optimization from months to days
onsemi’s role in NVIDIA MGX ecosystem expanding into 800VDC power architectures
Infrastructure power demands accelerating in increasingly compute-dense AI environments
Qorvo showcasing RF solutions with live demos and technical participation at IMS
Integrated solutions, foundry and services highlighted for aerospace, defense, satcom and wireless infrastructure applications
CGD’s new 650V ICeGaN device for automotive applications helps increase EV range
Low on-resistance improves inverter efficiency for reduced thermal management provision and higher-frequency switching
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