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Imec’s 300mm RF silicon interposer platform for chiplet-based heterogeneous integration demos record low insertion loss at frequencies up to 325GHz
Flexible integration of digital, analog, RF-to-sub-THz CMOS and III/V chiplets on a single carrier paves way for high-performance RF and mixed-signal applications
Sivers provides extra details on new debt financing with US bank
Three-year $12m loan, with annual refinancing option
Wolfspeed re-hires former LED Products division head David Emerson as chief operating officer
Emerson to oversee Operations, Supply Chain, and Quality divisions
Singapore’s A*STAR’s inaugural Innovate Together event launches first industry-grade 200mm silicon carbide Open R&D Line
New facility to accelerate innovation and collaboration for silicon carbide devices
Altum RF showcasing products and expertise at IMS 2025
Highlights include new E-band family of power amplifiers and LNAs
Navitas launches 12kW GaN & SiC platform, achieving 97.8% efficiency for hyperscale AI data centers
PSU ‘designed for production’ achieves OCP requirements for high-power, high-density server racks, enabled by GaNSafe ICs and Gen-3 Fast SiC MOSFETs.
Toshiba and Global Power Technology accelerate SiC power device patent filings
Over 840 new patent families filed globally in Q1/2025, says Knowmade
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