AES Semigas

Honeywell
8 June 2026

GE Aerospace and Wolfspeed sign MoU to collaborate on accelerating high-voltage silicon carbide adoption

Wolfspeed to supply 10kV MOSFET die and jointly determine standard high-voltage power module formats

8 June 2026

onsemi introduces Elite Pairing Studio to simplify pairing SiC MOSFETs and gate drivers for power electronics design

Online interactive simulation tool gives visibility into device-level behavior and pairing trade-offs

8 June 2026

Infineon’s silicon carbide power modules to be used in Siemens’ semiconductor circuit breakers

Enhancing efficiency, power density and reliability of electrical protection in data centers, factories and battery storage systems

8 June 2026

Fraunhofer IAF presents innovations at PCIM

1200V GaN-based power electronics module used in demonstrator of bidirectional, single-phase 800V DC off-board EV charging system

8 June 2026

QPT unveils AI-driven design service for optimizing thermal interface layer

Automating generate-simulate-iterate loop cuts die attach optimization from months to days

8 June 2026

onsemi’s role in NVIDIA MGX ecosystem expanding into 800VDC power architectures

Infrastructure power demands accelerating in increasingly compute-dense AI environments

8 June 2026

Qorvo showcasing RF solutions with live demos and technical participation at IMS

Integrated solutions, foundry and services highlighted for aerospace, defense, satcom and wireless infrastructure applications 

8 June 2026

CGD’s new 650V ICeGaN device for automotive applications helps increase EV range

Low on-resistance improves inverter efficiency for reduced thermal management provision and higher-frequency switching

Bruker
LayTec

Microelectronics UK

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