AES Semigas

Honeywell
10 June 2026

Nexperia brings QDPAK packaging to 1200 V SiC MOSFETs to overcome thermal bottlenecks in high-power designs

Top-side-cooled SMD package provides practical route to higher power density and system efficiency while simplifying heatsink and mechanical integration

10 June 2026

ROHM launches new top-side-cooling package for SiC MOSFETs

High heat dissipation combined with high voltage support

10 June 2026

SemiQ expands high-thermal-performance QSiC Dual3 module range for SSTs and AC–DC converters in AI data-center power systems

Half-bridge series for data-center power converters and industrial motor drives features low-RDSon SiC MOSFETs and parallel SBDs

9 June 2026

Wolfspeed introduces Gen 5 SiC MOSFET technology

RDS(ON) reduced by up to 27% for 1200V devices

9 June 2026

Nexperia and Semikron Danfoss to explore strategic collaboration on SiC power modules for automotive applications

Combining semiconductor and module expertise to advance high-performance solutions for EVs

9 June 2026

Navitas introduces isolated through-hole package for 1200–3300V SiC MOSFETs

Direct-cooled thermal management offered by reflow-compatible, isolated thermal pad boosts power density, reliability and efficiency

9 June 2026

WIN’s 0.12µm GaN power process qualified for 40V operation

Increased amplifier power levels, rugged antenna switches and robust LNAs for multi-function integration and single-chip front-ends

8 June 2026

GE Aerospace and Wolfspeed sign MoU to collaborate on accelerating high-voltage silicon carbide adoption

Wolfspeed to supply 10kV MOSFET die and jointly determine standard high-voltage power module formats

Bruker
LayTec

Microelectronics UK

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