AES Semigas

Honeywell
10 April 2026

QuInAs links device physics to AI system performance using ULTRARAM

Work presented at International Symposium on Quality Electronic Design

9 April 2026

HRL’s T3L 40nm GaN-on-SiC technology achieves Manufacturing Readiness Level 6

Process is compatible with three-dimensional heterogeneous integration architectures

7 April 2026

IVWorks raises $4.5m to expand reGaN technology into RF and AI power semi markets

Targeting E/W-band RF in satcoms and wireless backhaul, and expanding into AI power delivery through PoL converters for HBM and GPU platforms

3 April 2026

EPC launches 100V integrated GaN power stage ICs for motor drives with improved control and protection

ePower Stage ICs provide fast shutdown in fault condition, support continuous 100% duty-cycle operation, and have single-input-pin PWM option to ease multi-axis designs

2 April 2026

onsemi’s hybrid power integrated modules used in Sineng Electric’s solar and energy storage solutions

F5BP PIMs integrate FS7 IGBT and EliteSiC diode technologies

1 April 2026

EPC Space adds EPC7C010 and EPC7C011 half-bridge buck platforms for high-rel and rad-hard applications

High efficiency and flexibility support next-gen aerospace and industrial systems with adjustable switching frequencies

27 March 2026

Wolfspeed reduces senior secured note balance by 43% after raising $475.9m in private placements

Refinancing to cut annual interest expense by $62m and total debt by $97m

Bruker
LayTec

Microelectronics UK

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