AES Semigas

Honeywell
18 November 2025

Filtronic completes multi-year project to develop plastic QFN packaging for GaN devices

Projects strengthens UK’s independence in critical semiconductor technology for defence, space and communication systems

18 November 2025

Wolfspeed launches 1200V silicon carbide six-pack power modules for E-mobility propulsion systems

Gen 4 power modules deliver 3x power cycling capability and 15% higher current capability

18 November 2025

University of Arkansas opens Multi-User Silicon Carbide Facility

MUSiC to provide open-access domestic opportunities for prototyping, proof-of-principle demos and device design

17 November 2025

imec achieves record GaN breakdown exceeding 650V on Shin-Etsu Chemical’s 300mm QST substrate

650V-rated HEMT to be followed by 1200V+ variant, targeting AI data-center, industrial and automobile applications

17 November 2025

SemiQ adds 7.4, 14.5 and 34mΩ SOT-227 modules to 1200V Gen3 SiC MOSFET line

QSiC power modules tested beyond 1400V, targeting battery chargers, photovoltaic inverters, server power supplies and energy storage systems.

12 November 2025

SK keyfoundry accelerating development of SiC-based power semiconductor technology

Core silicon carbide processes and design technologies secured via acquisition of SK powertech

12 November 2025

Infineon’s CoolGaN technology used in Enphase’s new IQ9 solar microinverter

CoolGaN bi-directional switch allows single-stage power conversion, replacing two or four unidirectional switches

11 November 2025

Wolfspeed’s 2.3kV LM Pack Module being integrated into Hopewind’s 950Vac Wind Power Converter

Collaboration enables Hopewind to launch wind power industry’s first all-SiC power cabinet

Bruker
LayTec

Microelectronics UK

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