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Microelectronics

12 March 2026

University of Sheffield to lead £12.5m UK Centre for Heterogeneous Integrated MicroElectronic and Semiconductor Systems

National ‘Design Commons’ shared bank of semiconductor design resources to support industry collaboration and skills development

12 March 2026

ROHM’s TRCDRIVE pack, HSDIP20 and DOT-247 silicon carbide molded power modules now available online

Distributors include DigiKey and Farnell

12 March 2026

Navitas appoints former Lattice chief accounting officer as CFO

Tonya Stevens to lead financial strategy, investor relations, treasury and global finance organization

12 March 2026

Navitas adds top-side-cooled QDPAK and low-profile TO-247-4L to package line-up in 5th-generation GeneSiC technology

GeneSiC 5th Generation TAP SiC MOSFET technology boosts performance and lifetime for AI data centers, grid and energy infrastructure, and industrial electrification with voltage ratings of 1200V

11 March 2026

SK keyfoundry develops 450–2300V SiC planar MOSFET process platform

Order from new customer to develop 1200V product marks start of full-scale silicon carbide business

10 March 2026

Wolfspeed unveils foundation for AI data-center advanced packaging leveraging 300mm silicon carbide

Patent-pending innovations deliver scalable materials building blocks for advanced AI and high-performance computing packaging

10 March 2026

Indra leading GIGaNTE project to develop autonomous Spanish gallium nitride and advanced packaging technologies

Project to give Spain capacity to design, manufacture and integrate GaN-based equipment for defence and communications systems

9 March 2026

Skyworks and MediaTek demo early 6G FR3 and PC1 RF front-end innovations at MWC

Engineering samples to be available to early-access partners in alignment with MediaTek’s chipset evaluation schedule

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