AES Semigas

Honeywell
24 November 2025

STMicroelectronics launches GaNSPIN system-in-package family

GaN ICs tailored for motor drives in white goods and factory automation

24 November 2025

PowerAmerica issues request for proposals for 24-month projects

Projects to develop wide-bandgap power semiconductor technologies, power electronics assemblies, and packaging and manufacturing processes

20 November 2025

GlobalFoundries and Navitas partner on US GaN technology and manufacturing

Partnership expands US capacity for GaN technology, design and at-scale manufacturing for AI data centers and critical power applications

19 November 2025

onsemi authorizes $6bn share repurchase program

New program doubles prior share repurchase authorization

18 November 2025

Filtronic completes multi-year project to develop plastic QFN packaging for GaN devices

Projects strengthens UK’s independence in critical semiconductor technology for defence, space and communication systems

18 November 2025

Wolfspeed launches 1200V silicon carbide six-pack power modules for E-mobility propulsion systems

Gen 4 power modules deliver 3x power cycling capability and 15% higher current capability

18 November 2025

University of Arkansas opens Multi-User Silicon Carbide Facility

MUSiC to provide open-access domestic opportunities for prototyping, proof-of-principle demos and device design

17 November 2025

imec achieves record GaN breakdown exceeding 650V on Shin-Etsu Chemical’s 300mm QST substrate

650V-rated HEMT to be followed by 1200V+ variant, targeting AI data-center, industrial and automobile applications

Bruker
LayTec

Microelectronics UK

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