AES Semigas

HoribaHoriba
19 December 2024

Power Integrations adds wide-creepage switcher IC for 800V automotive applications

1700V InnoSwitch3-AQ flyback switcher meets IEC60664-1 isolation standard

19 December 2024
Fully vertical GaN p-i-n diodes on silicon
Soft breakdown reaches 1200V with 0.48mΩ-cm2 on-resistance.
18 December 2024

Fraunhofer IAF gains €4.35m from Baden-Württemberg to contribute to EU Chips Act-funded APECS pilot line

New epi, process and metrology equipment to produce chiplets and interposers on 6” wafers

18 December 2024

APECS pilot line starts operation

Advanced Packaging and Heterogeneous Integration for Electronic Components and Systems joins other EU Chips Act-funded pilot lines

18 December 2024

CSA Catapult’s annual report focuses on Net Zero and Future Telecoms

ESCAPE project helps to establish UK’s first complete end-to-end supply chain for SiiC power electronics

17 December 2024

X-FAB launches next-gen silicon carbide process platform for power MOSFET designs

Streamlined SiC processes for faster custom MOSFET development

16 December 2024

Wise-integration signs Astute as EMEA distributor

Collaboration to accelerate adoption of GaN for consumer electronics, EVs, data centers and industrial automation

13 December 2024

Bosch allocated $225m in US CHIPS Act funding, plus $350m in loans

Funds to support $1.9bn transformation of Roseville fab for SiC power device production

Bruker
Aixtron
K-Space
LayTec

PIC Summit Europe

Book This Space