31 October 2024
High-current vertical diamond MOSFETs
Researchers achieve drain currents above 1A by connecting two devices.
31 October 2024
Planned 8-inch silicon carbide wafer fabs worldwide reach 14
ST, Onsemi, Infineon, Wolfspeed, ROHM, BOSCH, Fuji Electric, Mitsubishi Electric, VIS/EPISIL, Silan, UNT and FT1 all plan SiC plants, notes TrendForce.
31 October 2024
Transfer-printed lasers on silicon photonics
Ireland’s Tyndall National Institute and Intel have improved alignment by fabricating InP lasers after, rather than before, transfer printing to SOI waveguides.
31 October 2024
DBR-free thin-film InGaN VCSELs
Device achieves lasing without lateral confinement under optical pumping.
31 October 2024
Micro-LEDs on freestanding GaN
An optimized InGaN multi quantum well structure has increased the external quantum efficiency from 7.9% to 14.8% at 10A/cm2 injection current.
31 October 2024
Micro-LEDs maintain momentum despite Apple’s withdrawal
New advances are needed in die technology, transfer equipment and micro-LED manufacturing, says Yole Développement.
31 October 2024
Defect-free AlGaInP native red micro-LEDs by wet chemical etching
Mike (M.C.) Yoo, CEO of Verticle Inc, highlights how undercut-free wet etching is ready for the mass production of phosphide-based micro-LEDs.
9 October 2024
Red/yellow InGaN micro-LED photodetectors for visual light communications
Researchers demonstrate high-data-rate reception from white LED transmitters.
