News

10 July 2009

 

SemiLEDs’ third Taiwan plant expands monthly capacity to 15m chips

SemiLEDs Corp of Boise, ID, USA has opened a third production plant in Hsin-Chu Science Park, Taiwan, bringing its capacity to 15 million 1mm x 1mm high-power LED chips per month.

SemiLEDs’ LED chips are manufactured using a unique, proprietary ‘metal vertical photon’ (Mvp) process that provides a flexible copper alloy base, enabling what is claimed to be the best thermal resistance on the market (0.4°C/W) as well as providing optical and electrical advantages. Packaged LEDs using SemiLEDs 1mm x 1mm chips typically produce an output of more than 110 lumens at 5000K and 350mA.

“Along with our ongoing collaboration with Aixtron on 6 inch wafers [announced at the end of April], this new facility will enhance our power LED capacity and allow us to stay ahead of ever increasing demand,” says CEO Trung Doan.

See related item:

Aixtron and SemiLEDs report successful fabrication of GaN-based blue LED chips on 6-inch sapphire wafers

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