FREE subscription
Subscribe for free to receive each issue of Semiconductor Today magazine and weekly news brief.



10 July 2009


SemiLEDs’ third Taiwan plant expands monthly capacity to 15m chips

SemiLEDs Corp of Boise, ID, USA has opened a third production plant in Hsin-Chu Science Park, Taiwan, bringing its capacity to 15 million 1mm x 1mm high-power LED chips per month.

SemiLEDs’ LED chips are manufactured using a unique, proprietary ‘metal vertical photon’ (Mvp) process that provides a flexible copper alloy base, enabling what is claimed to be the best thermal resistance on the market (0.4°C/W) as well as providing optical and electrical advantages. Packaged LEDs using SemiLEDs 1mm x 1mm chips typically produce an output of more than 110 lumens at 5000K and 350mA.

“Along with our ongoing collaboration with Aixtron on 6 inch wafers [announced at the end of April], this new facility will enhance our power LED capacity and allow us to stay ahead of ever increasing demand,” says CEO Trung Doan.

See related item:

Aixtron and SemiLEDs report successful fabrication of GaN-based blue LED chips on 6-inch sapphire wafers

Search: SemiLEDs LEDs