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22 October 2009


UCSB opts for OIPT FlexAL ALD tool for research

UK-based etch and deposition equipment maker Oxford Instruments Plasma Technology (OIPT) says it has received an order for a FlexAL Atomic Layer Deposition (ALD) tool from University of California Santa Barbara, (UCSB) CA, USA. The FlexAL Plasma ALD system allows the combination of both plasma and thermal ALD in a single, compact tool making it ideal for leading edge research, adds the firm.

“The UCSB Nanofabrication Facility is excited at the addition of the Oxford Instruments FlexAL ALD system. This system offers great flexibility for thermal and plasma-based processes with in-situ diagnostic tools to address the needs of a diverse optical and electrical device research effort within our facility,” says Brian Thibeault, UCSB, Dept. ECE.

Chris Hodson, ALD Product Manager at OIPT added, “Oxford Instruments is pleased that UCSB selected our most advanced Plasma ALD system for their future research activities in thin film growth. We are also excited to be part of the university’s Nanofabrication Facility’s success linking local nanotechnology companies and researchers into a chain that stretches across the country. This is our fourth Plasma ALD system in the NNIN network.”

See related item:

KAUST places follow-on orders with Oxford Instruments

See: Oxford Instruments Company Profile

Search: OIPT FlexAL ALD