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9 September 2009

 

Kulicke & Soffa launches ConnX-LED automatic ball bonder

At this week’s 11th China International Optoelectronics Expo at the Shenzhen Convention and Exhibition Center, chip assembly equipment and packaging materials supplier Kulicke & Soffa Industries Inc (K&S) of Fort Washington, PA, USA is extending its ConnX bonding platform by launching the ConnX-LED automatic ball bonder.

With new features and enhancements specifically designed for LED applications, K&S says that ConnX-LED can help to increase efficiency and productivity, and meet the challenges of the fast-paced, high-growth LED market.

The firm says that the ConnX-LED has all the features required for bonding LED packages, including accuracy to ±3.5 microns, automatic recovery paths for common production stoppages, and programmable back-up power, reducing cost of ownership in a highly competitive market space.

ConnX-LED joins the iStack, ICONN ConnX and ConnX-VLED in Kulicke & Soffa’s Power Series platform for next-generation assembly equipment in challenging applications. Driven by what is claimed to be the most powerful X-Y-Z motion control system available on the market, the firm says that its Power Series products deliver high levels of speed, accuracy and throughput for reduced cost of ownership for the segment that the respective model serves.

“Recent industry research projects a 20% annual growth rate in total LED demand through 2012, as LED backlight displays and energy-saving lighting solutions continue to penetrate their market niches,” says chairman & CEO Scott Kulicke. “The launch of ConnX-LED is just one of the steps we’ve taken recently to optimize our product portfolio and distribution approach to address this market, one we have not traditionally served,” he adds. “We are now well positioned with the right products and sales infrastructure to gain meaningful share in this important and growing segment,” he believes.

See related item:

Kulicke & Soffa launches automated vertical LED ball bonder

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