News

21 June 2010

 

Skyworks launches 5mm x 6mm CMOS front-end module for entry-level GPRS

Skyworks Solutions Inc of Woburn, MA, USA, which makes linear products, power amplifiers, front-end modules and radio solutions for handset and infrastructure equipment, has launched the SKY77555 complementary metal oxide semiconductor (CMOS) front-end module (FEM) for entry-level general packet radio service (GPRS) handsets. By eliminating the need to optimize matching between the amplifier and the switch, the module helps to accelerate time-to-market relative to other more traditional architectures, and simplifies the supply chain for high-volume, cost-sensitive phones, it is claimed.

The SKY77555 is a transmit and receive FEM based on CMOS PAs for dual-band cellular handsets comprising GSM900 and DCS1800 operation. Designed in a low-profile and compact (5mm x 6mm) form factor, the FEM offers a complete transmit voltage-controlled oscillator (VCO)-to-antenna and antenna-to receive surface-acoustic wave (SAW) filter solution. The device also supports Class 12 GPRS multi-slot operation.

To date, Skyworks has shipped tens of millions of CMOS-based power amplifiers (PAs) for mobile phones (far more than all other suppliers combined, it is reckoned). These include the AX502 and AX508, which integrate a full quad-band GSM/GPRS PA function on a single integrated circuit using 0.13 micron CMOS process technology. Skyworks' CMOS portfolio also supports existing product roadmaps in several adjacent linear products markets, such as low-power smart-grid networks and wireless meter-reading solutions.

“Skyworks’ CMOS and GaAs front-end modules allow handset manufacturers to create ultra-small and low-cost GSM/GPRS solutions, as well as to select different price versus performance options from the same basic phone design,” says Gregory L. Waters, executive VP & general manager for front-end solutions. “Our technology-agnostic approach provides our customers with a unique advantage in meeting their platform, geographic and cost needs,” he adds. “Looking ahead, we will continue to leverage both silicon and GaAs technology across a variety of new products, ranging from entry-phone devices to industry-leading, low-cost smart-phones and 3G/4G solutions.”

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