19 October 2010


Fraunhofer Research Institution for Electronic Nano Systems orders EVG’s UV-NIL/hot embossing systems

EV Group (EVG) of St. Florian, Austria says it has received its first order from the Fraunhofer Research Institution for Electronic Nano Systems (ENAS).

Fraunhofer ENAS purchased an EVG6200NT automated mask aligner and an EVG540 automated wafer bonder, and will employ the flexible, multi-process systems for mask lithography, ultraviolet nanoimprint lithography (UV-NIL), bond alignment, bonding and hot embossing (HE), says the firm. The systems, which will enable Fraunhofer ENAS to process product wafers up to 200 mm in diameter, are due for delivery in November.

“NIL and hot embossing are key processes for extending our advanced R&D efforts," said Dr Thomas Gessner, a professor and director at Fraunhofer ENAS. "The EVG systems allow us to implement these technologies far better than competitive tools. We can now perform full-area nanoimprints, as well as optically aligned UV-NIL and HE, on larger wafers, further expanding our ability to support a broad spectrum of processes."

EVG's recently announced soft molecular scale UV-NIL, or SMS-NIL, technology patterns ultra-high-resolution features down to 12.5 nm on EVG's proven UV-NIL systems. The technology uses soft polymeric working stamps to avoid damaging costly master stamps. The firm says that SMS-NIL is already used in industrial environments for CMOS image sensors, micro-lens molding and other optical applications.

"This order from a leading research partner such as Fraunhofer ENAS underscores the value of our ongoing efforts to develop and implement new, leading-edge technologies that compliment and extend the applications for our systems," said Markus Wimplinger, EVG's corporate technology development and IP director. "Not only will our tools' flexibility allow Fraunhofer ENAS to perform multiple lithography, alignment and bonding processes on just two systems, but through close cooperation between both companies, processes such as EVG's unique SMS-NIL technology, as well as hot embossing processes, will be implemented and further advanced."

Search: EVG Wafer bonding Mask aligner Fraunhofer ENAS UV-NIL Hot embossing


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