18 October 2010


SET launches patented chamber for oxide removal in device bonding

Replisaurus Technologies subsidiary SET (Smart Equipment Technology) of Saint-Jeoire, France (which supplies die-to-die, die-to-wafer bonding and nanoimprint lithography solutions) has unveiled a patented system that enables thorough removal of oxides before or during the bonding sequence.

Addressing the challenges of oxidation of metal surfaces in device bonding, the system encompasses a substrate chuck and a bond head with a non-contact localized confinement chamber that operates safely with reducing gases such as forming gas or formic acid vapor. It can be implemented on any new SET bonder models FC150 and FC300.

To preserve the standard capabilities of SET's bonding tools and especially the low-contact-force measurement applied to the components, the ‘Semi-Open’ Confinement Chamber has no hardware sealing. A non-contact virtual seal of the micro-chamber enables gas confinement for chip-to-chip or chip-to-wafer bonding under a controlled atmosphere; it ensures gas collection and prevents oxygen intrusion while preserving the alignment of the device with respect to its substrate. Consequently, it ensures what is claimed to be excellent wetting and a higher quality of solder joints at reduced bonding forces and temperatures as well as higher yield, as no cleaning step is required.

SET says that the technology provides a solution to overcome the bonding challenges of demanding applications using AuSn and indium, such as optoelectronics assembly (laser bars, VCSELs) and imaging sensors (IR-FPAs).

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