1 February 2011

TriQuint launches multi-mode power amplifier module for Qualcomm’s 3G/4G chipset

RF front-end product maker and foundry services provider TriQuint Semiconductor Inc of Hillsboro, OR, USA has announced the availability of its first multi-mode power amplifier (MMPA) module developed for Qualcomm’s 3G/4G chipset.

A member of the TRIUMF Module family, the TQM7M9023 combines with TriQuint’s TRITIUM PA-Duplexer Module family to offer a complete RF system solution for smartphones and other mobile devices.

“It integrates WCDMA functionality around our core competence of GSM/EDGE power amplifiers while providing customers a flexible, high-performance platform solution to meet the increasing band-count combinations in 3G/4G handsets,” notes Tim Dunn, VP & general manager of Mobile Devices at TriQuint. “Our ability to integrate passive and active devices into high-performance system solutions continues to propel TriQuint’s value in the smartphone market,” he adds.

TriQuint says that its MMPAs provide several benefits to mobile device vendors:

• decreased overall radio solution size to enable a greater feature set in a smaller form factor;

• simplified PCB routing for improved performance and design cycles; and

• a reduction in bill of materials (BOM) count that improves manufacturing efficiency.

The firm says that the combination of the MMPA and its Band 2 and Band 5 TRITIUM modules offers a flexible and simplified RF solution that can reduce mobile device engineering and development time.

Using TriQuint’s in-house CuFlip technology, the TQM7M9023 achieves a compact 5.0mm x 7.5mm footprint. The MMPA integrates quad-band GSM/EDGE functionality with WCDMA Bands 1 & 8 into a single package. Building on its capabilities in the EDGE market, TriQuint says that the MMPA can provide additional value through improved system performance and lower overall cost by replacing three discrete power amplifier modules and associated matching components.

As a fully integrated MMPA, the TQM7M9023 includes a GSM/EDGE power amplifier, WCDMA power amplifiers, high-performance coupler, regulatory circuitry and matching components. It does not require an external DC/DC converter or complicated band switches, providing optimum RF performance at maximum output and backed-off power levels for both data and voice applications, respectively. The TQM7M9023 is sampling now and should ramp into production by mid 2011.

Designed to support the MMPA, TriQuint's Band 2 TQM61605x and Band 5 TQM66605x TRITIUM PA Duplexers integrate high-performance bulk acoustic wave (BAW) and surface acoustic wave (SAW) duplexer capabilities with low current consumption power amplifiers to customize traditional components for optimal performance.

The new TRITIUM PA-Duplexers are about 50% smaller in size compared to TriQuint’s TRITIUM family, of which more than 200 million units were shipped in 2010. Leveraging TriQuint’s new second-generation BAW technology as well as its SAW capability, the modules allow multi-mode CDMA and WCDMA operation, enabling use of a single product across multiple platforms. Each module contains a flip-chip BiHEMT power amplifier die, achieving what is claimed to be industry-leading current consumption for maximum talk-time and thermal efficiency (critical for smartphone applications). The new TRITIUM PA-Duplexers will sample in second-half 2011.

TriQuint will highlight these platform solutions at the GSMA Mobile World Congress 2011 in Barcelona, Spain (14–17 February).

Tags: TriQuint PAM Qualcomm

Visit: www.triquint.com