16 February 2012

OIF to demo multi-vendor interoperability of chip-to-module electrical interfaces for 28G VSR

In the OIF booth (#713) at the Optical Fiber Communication Conference and Exhibition/National Fiber Optic Engineers Conference (OFC/NFOEC 2012) in Los Angeles, CA, USA (6-8 March), ten members of the Optical Internetworking Forum (OIF) are uniting to showcase multi-vendor participation in ‘OIF Interoperability 2012 – Enabling High-Speed Dynamic Services’. The OIF’s Physical and Link Layer (PLL) demonstration will showcase interoperability of the OIF’s Common Electrical Interface (CEI) 28G Very Short Reach (VSR) draft implementation agreement that defines chip-to-module electrical interfaces. Demonstrations of the CEI-25G-LR signal for backplane interfaces will also be tested.

The firms participating in ‘OIF Interoperability 2012’ are: Altera, Amphenol, Fujitsu Optical Components, Gennum, IBM, Inphi, Luxtera, Molex, TE Connectivity and Xilinx. Equipment used during the testing includes host IC with VSR SerDes, host PCB traces, optical module connectors, module retimers and optical transceivers. Test equipment is supplied by Tektronix Inc.

“This demonstration of CEI-28G-VSR shows the ability to reach 100G for next-generation 4x25Gb/s-based optical transceivers,” says Ed Frlan of Gennum and the OIF PLL Interoperability Working Group chair. “The CEI-25G-LR and CEI-28G-VSR electrical interface and signaling schemes being tested for interoperability support multiple 100G applications,” he adds.

“This interoperability test and demonstration shows a critical mass – with multiple vendors supporting the CEI-28G-VSR,” says Rod Smith of TE Connectivity and the OIF Marketing Awareness & Education Committee co-chair. “There is momentum in the marketplace to incorporate higher-speed signals.”

Tags: OIF

Visit: www.oiforum.com

See Latest IssueRSS Feed


This site uses some harmless cookies in order to function click here to view our Cookie and Privacy Policy