10 January 2012

Microsemi launches SiGe platform for 4G RF front-end module development

Microsemi Corp of Aliso Viejo, CA, USA (which designs and makes high-reliability analog and RF devices, mixed-signal ICs, FPGAs and customizable SoCs, and complete subsystems, based on silicon, gallium arsenide and silicon carbide) has announced its technology platform for 4G RF front-end modules (FEMs) based on silicon germanium (SiGe) technology. The firm is already developing next-generation IEEE 802.11ac wireless LAN FEMs on the new platform. IEEE 802.11ac is now being referred to as fifth-generation WiFi or 5G WiFi by the industry, notes Microsemi.

The new platform integrates multiple filters, switches, low-noise amplifiers (LNAs) and power amplifiers onto a single monolithic SiGe die, and supports multiple input/multiple output (MIMO) functionality. The high level of integration allows substantial reductions in cost and printed circuit board footprint (key considerations when designing devices such as smartphones and tablets).

“Microsemi has developed what we believe to be the world’s first silicon germanium-based, single-chip RF front-end module platform capable of meeting the stringent requirements of 4G applications while still offering space and cost savings,” says Darcy Poulin, director of product engineering.

According to ABI Research, IEEE 802.11ac shipments will increase significantly in 2013, with 802.11ac emerging as the dominant Wi-Fi protocol by 2014. Industry research firm In-Stat estimates that nearly 350 million routers, client devices and attached modems with 802.11ac will ship annually by 2015, up from about 1 million units in 2012.

“The first-of-its-kind digital tuning capability we have designed will reduce future development times and customization efforts as we engage our baseband partners,” says senior VP Paul Pickle. “In addition, the performance achieved will enable Microsemi to drive innovation into the latest wireless LAN standard, IEEE 802.11ac, as well as the next-generation 4G mobile standard,” he adds.

Microsemi’s RF front-end-module includes two fully functional 2.5GHz IEEE 802.16 power amplifiers, two transmit/receive switches, two LNAs, two baluns, harmonic and noise shaping filters, and a digital interface for control and tuning. Its performance meets the strict 802.16 mask and EVM requirements at an output power of 24dBm in a 5mm x 5.6mm package.

The firm’s next-generation wireless LAN dual-band FEM will be able to integrate highly linear 802.11ac-compliant 2.4GHz and 5GHz PAs, 2.4 and 5GHz bypassable LNAs, switches, filters, a diplexer and an I2C digital interface into a 3mm x 4mm QFN package.
Microsemi has previously shipped more than 200 million RFICs globally, predominantly for the wireless LAN market.

Tags: Microsemi SiGe FEM

Visit: www.microsemi.com

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