18 June 2012

Luminus’ new LED packaging technology cuts thermal resistance by 30%, allowing 20% greater brightness

Luminus Devices Inc of Billerica, MA, USA, which makes PhlatLight (photonic lattice) LEDs for illumination applications, has launched its latest development in packaging technology, which uses proprietary processes and new specialty materials and equipment to achieve a 30% reduction in thermal resistance for its ‘Big Chip’ LED products. This, in turn, enables the LEDs to reach up to 20% higher brightness levels while maintaining reliability during operation, the firm says.

“This breakthrough allows for a simpler thermal design at the system level, and therefore chips to be driven at higher power in applications where maximum brightness is required, such as projection displays and entertainment,” says VP of engineering Arvind Baliga. “The innovation will enable smaller and more cost-effective projector system designs, from small-form-factor to high-brightness data projectors in projection display market segments, as well as high-brightness wash lights and spot lights for entertainment,” he adds.

“The new LED thermal technology is the result of continued focus on R&D, and it enables our customers to increase the brightness of our LEDs without lifetime or reliability concerns due to overheating,” says Paul Panaccione, director of packaging technology.

Luminus is sampling products based on the new technology to several customers; production quantities will be available in the coming quarter.

Tags: Luminus LEDs

Visit: www.luminus.com

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