31 May 2012

AWR Design Forum adds Taiwan to schedule; call for papers opened

AWR Corp of El Segundo, CA, USA, a supplier of electronic design automation (EDA) software for designing RF and high-frequency components and systems, has added Taiwan to the list of cities scheduled for the July tour of its AWR Design Forum (ADF) 2012. The Taiwan event will take place on 12 July.

The call for papers for the Taiwan forum, as well as for those in Japan and Korea, is now open.

ADF 2012 is an open event for designers of microwave and RF circuits and systems (such as MMIC, RFIC, RF PCB, modules and communication systems) to come together to learn about AWR’s latest products and technologies and how they can help solve both existing and future design problems. It also provides an opportunity to network and collaborate on industry issues and trends.

Agenda topics presented by AWR and partner firms National Instruments, WIN Semiconductor and Zuken may include:

  • Optimizing the Design and Verification of 4G RF Power Amplifiers;
  • Design of a Novel Multi-Slot Antenna Featuring EM Parameterization and Optimization Techniques;
  • Simulating an NXP Doherty Power Amplifier with Digital Pre-Distortion;
  • Electrical/Thermal Coupled Solutions for Flip Chip Designs;
  • Design and Simulation of Modern Radar Systems;
  • Fully Integrating 3D Electromagnetic (EM) Simulation into Circuit Simulation;
  • System Simulation Featuring Signal Processing Blocks;
  • RF Link Prediction - A New and Novel Approach;
  • Linking RF Design through to Test;
  • RF Moving Beyond a Linear Datasheet;
  • MMIC Design in AWR 2011; and
  • The AWR Design Flow Advantage - Introduction to New Features and Capabilities.

The forum also provides an opportunity for the presentation of papers from customers and partners working in the microwave & RF industry, as well as from research and educational institutions. Participants interested in presenting should contact adf2012@awrcorp.com.

Suggested topics include - but are not limited to - RFIC and MMIC design, EM analysis of planar components and 3D passive interconnect, and LTE communication system and radar applications, as well as microwave components, RF and microwave circuit boards, and RF SoCs, SiPs, and module design. All presentations will be made available for download from the AWR web site after the event concludes. Additionally, prizes will be awarded for best paper/presentation per location.


Visit: www.awrdesignforum.com

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