2 May 2012

Carsem extends packaging services to high-brightness silicon substrate LED arrays

Carsem Inc of Scotts Valley, CA, USA, which provides turnkey semiconductor packaging & test services, is partnering with a key customer to assemble and further develop LED packaging technologies.

Carsem has assembled and qualified high-brightness silicon substrate LED arrays and will begin offering high-volume, full turn-key manufacturing services, including electrical testing, laser mark and tape-and-reel, in early 2012.

The firm says that the manufacturing process fully utilizes the advantage of standard mass-production process of assembly and test including matrix substrate design; auto die attach, wire bond and high-reflectivity coating dispense; compression molding through auto-mold system; mapping of units on substrate and bin sort per test mapping.

The silicon substrate LED array offers higher white light brightness with much less energy required (luminous efficacy of more than 50 lumens/Watt). The life expectancy of the product is estimated to be 10 years. General applications include home use, cars ,and special- effect light.

“Because of our extensive experience in providing turnkey solutions, we are able to share our expertise with our LED customers and assist them in getting their products to market faster with turnkey solution on high-density and high-volume packaging,” claims Albert Law, Carsem's VP of worldwide sales & marketing, “Carsem is expanding the company’s portfolio to include LED packaging solutions for the high-brightness LED applications,” he adds.

“By capitalizing on our extensive semiconductor experience in materials, process & equipment we have successfully advanced into the LED arena, thereby enhancing the manufacturability and efficiency of high-brightness LED,” says chief technology officer L.W. Yong.

Tags: Silicon substrates LEDs

Visit: www.carsem.com

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