3 May 2012

Micross to distribute GeneSiC’s bare die

GeneSiC Semiconductor Inc of Dulles, VA, USA, which develops silicon carbide (SiC) and silicon-based devices for high-temperature, radiation and power grid applications, has agreed to Micross Components of Orlando, FL, USA (a global provider of distributed and specialty electronic components) being an authorized supplier of its bare die products worldwide. The firms say that the driving force behind the agreement is the shared commitment to increase the availability of SiC bare die to the industrial, military, aerospace, and energy sectors (particularly, drilling and exploration).

GeneSiC says that for years silicon has been the building block of semiconductor design and fabrication because of its natural abundance, processing ease and relatively useful (although limited) temperature range. By comparison, SiC offers enhanced performance, a broader temperature range, greater reliability, and natural radiation resistance. Until recently, challenges and costs associated with SiC production had limited its use among semiconductor manufacturers. However, GeneSiC claims that its design and fabrication advances have increased yields, resulting in more competitive pricing and offerings (such as its Schottky diodes, claiming significant design and performance advantages).

Extending those advantages to bare die customers will be Micross’ role under the new agreement. GeneSiC says that, as an independent distributor of die products worldwide, Micross has both the product and assembly expertise required to certify the GeneSiC bare die for high-temperature/high-reliability applications, as well as the sales channels needed to reach potential customers around the globe. Further, with its technical knowledge and resources, Micross can provide long-term product support to all die customers.

“With Micross’ marketing and product support, we can confidently grow this part of our business,” says GeneSiC’s chief business development officer Michael DiGangi. “Having GeneSiC as a technology partner will be a great advantage for our customers who, by virtue of their specialty applications, are always pushing performance limits,” adds Tony Hamby, Micross’ general manager for Die Distribution in the USA.

Tags: GeneSiC Micross SiC

Visit: www.genesicsemi.com

Visit: www.micross.com

See Latest IssueRSS Feed


This site uses some harmless cookies in order to function click here to view our Cookie and Privacy Policy