21 May 2012

VI Systems launches 40G VCSELs with HAB pad design for robust bonding and packaging

VI Systems GmbH of Berlin, Germany (a fabless spin-off of the Technical University of Berlin and the A. F. Ioffe Physico-Technical Institute in St Petersburg, Russia that provides laser and photo-detector chips and modules) has launched a new product line of high-speed VCSEL chips that operate with data rates of up to 40Gb/s.

The new generation of high-speed 850nm VCSELs and 1x4 and 1x12 VCSEL arrays feature an ultra-high -3dB modulation bandwidth of 20GHz. They also have a novel HAB contact pad design which overcomes the problems of thick and soft planarization layers (characteristic to high-speed VCSEL designs) and which enables ultra-robust bonding and packaging.

VI Systems says that its novel manufacturing approach and array designs are in compliance with the standard 250┬Ám device-to-device pitch (linear spacing), allowing systems developers to dramatically extend their capabilities in energy-efficient data communication. Die-level samples are available now.

Tags: VI Systems 40G VCSELs

Visit: www.v-i-systems.com

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