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14 November 2012

Texas State chooses EVG501 wafer bonding system for compound semiconductor and silicon-based power device R&D

EV Group (EVG) of St Florian, Austria, a supplier of wafer bonding and lithography equipment for the MEMS (micro-electro-mechanical system), nanotechnology and semiconductor markets, has installed an EVG501 wafer bonding R&D system at Texas State University.  The system, which is configurable for a variety of wafer bonding processes, will be used for advanced compound semiconductor and silicon-based power device research and development.

"Following a thorough evaluation of a number of wafer bonding systems, we selected EVG's solution for its superior technology capabilities.  The affordable R&D system demonstrated outstanding results, with high pressure conformity and bond consistency," said Edwin Piner, Associate Professor, Physics, at Texas State University.  "EVG has a strong support network and we will work closely with their experienced process teams to further the development of bonding processes for specialized compounds."

EVG501 can handle small substrate pieces up to 200-mm wafers, and supports a variety of bonding processes, such as anodic, glass frit, eutectic, diffusion, fusion, solder and adhesive bonds, as well as other thermal processes, including oxide removal and high-temperature bakes under a controlled atmosphere.  The system also offers quick re-tooling with a conversion time of less than five minutes, making it ideal for universities and R&D as well as small-volume production applications, says the firm.

Garrett Oakes, North American director of Technology for EV Group, said, "Working with Texas State marks a further step in our partnering with leading universities and research firms around the world in their efforts to develop solutions to today's challenges as well as exploring advancements that will address future industrial needs.  We look forward to a long-term collaborative partnership with Texas State University."

Tags: EVG Wafer bonding system


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