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1 November 2012

Microsemi introduces SiGe-based monolithic RF front-end for Broadcom's 5G WiFi mobile platforms

Microsemi Corp of Aliso Viejo, CA, USA (which designs and makes high-reliability analog and RF devices, mixed-signal integrated circuits, FPGAs and customizable SoCs, and complete subsystems, based on silicon, gallium arsenide and silicon carbide) says it has delivered the world's first monolithic silicon germanium (SiGe) RF front-end (FE) device (the LX5586 RF FE) for the 5th generation of Wi-Fi devices based on IEEE 802.11ac standard.

LX5586 RF FE is designed to be used in conjunction with Broadcom's BCM4335 combo chip for mobile platforms such as smartphones and tablets. BCM4335 is the industry's first combo chip solution based on the IEEE 802.11ac standard, also known as 5G WiFi, says the firm.

LX5586's technical features:

  • fully integrated, single chip 802.11ac 5GHz PA, LNA with bypass and SPDT antenna switch; 
  • small footprint of 2.5mm x 2.5mm and only 0.4mm height; 
  • ultra-linear power of 16dBm at 1.8% EVM, 256QAM modulation over 80MHz bandwidth; 
  • high ESD protection of 1000V (HBM) on all pins. 

"We're pleased to enter the 802.11ac market in collaboration with Broadcom," said Amir Asvadi, VP & general manager at Microsemi. "The LX5586 is the smallest, most reliable, highest performance solution in the marketplace today and the first in a series of highly-integrated Wi-Fi subsystems we are introducing to our customers."

"Broadcom is enabling the 5G WiFi ecosystem across all major wireless product segments," said Rahul Patel, Broadcom’s VP, Mobile Wireless Connectivity Combos Group. "Microsemi's new RF power amplification solutions further underscore the traction behind 5G WiFi, which has been recognized as one of the most significant wireless innovations of the year."

Industry analyst firm NPD In-Stat says that 802.11ac will grow rapidly. Chipset shipments will surpass 650m by 2015, with total Wi-Fi chipset revenue reaching $6.1bn. By 2015, the three biggest markets for 802.11ac are forecast to be smart phones, notebooks and tablets.

LX5586 is fixed at 2.5mm x 2.5mm 16-pin QFN package.

Tags: Microsemi SiGe Broadcom




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