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27 August 2014

SemiLEDs launches chip-scale ReadyMount Enhanced CSP white LEDs, combining flip-chip and ReadyWhite technologies

LED chip and component maker SemiLEDs Corp of Hsinchu, Taiwan has announced sampling and mass-production availability of its newest line of white chip-scale packages, the ReadyMount Enhanced CSP (EC) series.

By combining SemiLEDs’ Enhanced Flip-chip (EF) approach with the firm’s ReadyWhite phosphor technology, the EC delivers what is claimed to be unprecedented flexibility, reliability and manufacturability in a single 1.4mm x 1.4mm low-profile device. Rated for input power of up to 3W, the EC is a fully packaged white emitter SMD component, ready for surface mounting on any board-level module or chip-on-board (COB) application, lowering capital costs and enabling extremely high-lumen-density configurations, it is claimed.

“Our unique chip-scale package (CSP) brings all the benefits of SemiLEDs’ rugged EF Series FlipChip architecture to an extremely compact emitter, which is simple to integrate using standard tape & reel surface-mount manufacturing,” says Mark Tuttle, general manager for SemiLEDs Optoelectronics Co Ltd. “This innovation reduces final component cost up to 50%, with a packaging cost reduction of up to 80% over conventional packaging,” he reckons. “EC Series products, such as the EC-W1414, enable system integrators and luminaire manufacturers a direct path to a highly cost-effective solution on a per-lumen basis now, with additional viewing angles and die sizes under development.”

While useful for creating compact multi-die white packaged LEDs, the ReadyMount products can benefit light-engine and luminaire manufacturers who have previously had to rely exclusively on packaged die solutions, says SemiLEDs. Incorporating the firm’s EF Series FlipChip, the electrical contacts are moved to the bottom of the chip, leaving an emitting surface that is uninterrupted by wire bonds or top-side electrodes. The result is a compact chip-scale package, just 0.4mm high, with output of up to 300 lumens at 1A.

The EC series is available in standard ReadyWhite correlated color temperatures (CCTs) ranging from 2700K to 10,000K with color rendering indices (CRIs) up to 90 minimum.

In addition to the manufacturing benefits of the chip-scale package, elimination of the wire bonds also improves the optical integration characteristics by taking advantage of the unobstructed and nearly edge-to-edge emitting chip surface that enables the die to be mounted very close together. This simplifies the optics by eliminating the need for complex mixing lenses that are used to control ghosting and shadows in narrow-beam applications. The glass top surface is also very mechanically robust, and is not prone to the handling damage or stresses faced by wire-bond or flip chips with a silicone covering. The typical 145 degree field of view also demonstrates good color-over-angle characteristics as a result of the ReadyWhite technology, says SemiLEDs.

By enabling densely packed mounting with simplified optics, the EC series is suitable for general lighting applications including indoor and outdoor lighting, architectural lighting, and torches/flashlights. The rugged architecture and compact size of the single white die are also suited to mobile device flashes and LCD backlighting applications, says the firm.

Tags: SemiLEDs

Visit: www.semileds.com

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