- News
10 July 2014
MACOM adds 90W 2-stage, fully matched surface-mount power module for pulsed avionic applications to GaN portfolio
M/A-COM Technology Solutions Inc of Lowell, MA, USA (which makes analog semiconductors, components and subassemblies for analog, RF, microwave and millimeter-wave applications) has announced the newest entry in its portfolio of GaN in Plastic power module products. Optimized for pulsed avionics applications in the 960-1215MHz band, the MAMG-001214-090PSM 2-stage, fully matched gallium nitride (GaN) surface-mount power module scales to peak pulse power levels of 100W in a 14mm x 24mm package size.
MACOM says that its new high gain GaN in Plastic power modules support surface-mount technology (SMT) assembly, providing cost and process advantages compared with ceramic-packaged flange-mount components. Delivering benefits in size, weight and power (SWaP) while enabling high-volume manufacturing efficiency, the new GaN power modules feature a land grid array (LGA) pattern for enhanced thermal flow and ‘True SMT’ assembly, and do not require copper coining or complicated thermal management techniques on the system PC board.
Under pulsed conditions, the modules deliver output power greater than 90W, with 30dB of typical associated power gain and 60% typical power-added efficiency (PAE). Supporting 50V operation and up to 3ms pulse width/duration for improved signal flexibility, MACOM’s GaN in Plastic power modules reduce overall power consumption and cooling requirements compared with existing options, the firm claims.
“The 90W avionics module is the latest GaN Module in MACOM’s growing family of fully matched SMT power products,” says product manager Paul Beasly. “The ease of application, system benefits and surface-mount automated assembly are of great benefit to the customer, and critically also improve the time to market for rapidly evolving requirements in aviation and radar applications.”
MACOM’s new GaN in Plastic 90W power modules are sampling to customers now.