Temescal

ARM Purification

CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

Join our LinkedIn group!

Follow ST on Twitter

IQE

19 September 2014

Cree participating in roundtable on SiC-based power converters at Darnell Power Forum

Cree is to participate in the 11th annual Darnell Power Forum (DPF 2014) in Richmond, VI (23-25 September). As part of Darnell’s Energy Summit 2014 (a solutions-oriented conference and exhibition event that also hosts the Green Building Power Forum and the Smart Grid Electronics Forum), the international three-day forum will focus on advanced power conversion technologies enabling the development of next-generation power systems.

On 23 September (4-5pm), in the roundtable discussion ‘Where Does SiC Fit?’ a panel of experts will highlight SiC as the ‘most mature’ of new semiconductor materials vying for a place in next-generation power converters, and address topics such as the applications in which SiC brings the most value and how SiC compares to other new materials.

Dr Jeffrey Casady, business development & programs manager at Cree, joins fellow panellists Dr Daniel Fernández (chief technology officer of INAEL Electrical Systems and Coordinator of Project SPEED), Baxter Moody (director of device development at HexaTech Inc, Alex Lidow (CEO of Efficient Power Conversion Corp), and Carl Blake (vice president at Transphorm Inc). The moderator is Alex Huang, Progress Energy Distinguished Professor at North Carolina State University.

Tags: Cree SiC  Power electronics

Visit: http://dpf.darnell.com

Visit: www.cree.com/power

Share/Save/Bookmark
See Latest IssueRSS Feed

EVG