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20 October 2015

Element Six presenting diamond heat spreaders for thermal management of hotspots in GaN devices

At the IMAPS 48th International Symposium on Microelectronics in Orlando, FL, USA (26-29 October), Thomas Obeloer, business development manager at Luxembourg-registered synthetic diamond materials firm Element Six (a member of the De Beers Group of Companies), is presenting 'Optimizing Diamond Heat Spreaders for Thermal Management of Hotspots for GaN Devices' and will discuss the application of a hybrid silicon micro-cooler with diamond heat spreaders to effectively cool Gallium Nitride (GaN) devices.

As part of the session 'Packaging the Internet of Things & Other Advanced Applications: High Power / High Temperature', Obeloer will discuss the need for new thermal management solutions for GaN-based devices in order to preserve high reliability and to unlock GaN's intrinsic performance potential as devices become increasingly smaller with higher power densities.

Obeloer is presenting findings from an extensive experiment measuring the effectiveness in heat dissipation leveraging several grades (i.e. thermal conductivities) of chemical vapor deposited (CVD) diamond heat spreaders paired with a silicon-based micro-cooler. Results prove that the maximum chip temperature can be reduced by more than 40%, says the firm, and that 10kW/cm2 hotspot heat flux can be dissipated while maintaining the maximum hotspot temperature under 160°C.

See related items:

Element Six Technologies to accelerate synthetic diamond development in 2015

Element Six launches thermal grade of CVD diamond for heat management

Element Six's GaN-on-diamond wafers shown by Raytheon to provide three-fold boost in power density vs GaN-on-SiC for RF devices

Tags: Element Six Technologies GaN-on-diamond

Visit: www.imaps.org/imaps2015

Visit: www.e6.com/GaN

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