Temescal

ARM Purification

CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

Join our LinkedIn group!

Follow ST on Twitter

IQE

7 December 2016

ClassOne reports record sales, driven by wafer-level packaging and More than Moore technologies

ClassOne Technology of Kalispell, MT, USA, which manufactures wet-chemical processing equipment including Solstice electroplating systems (especially for emerging markets and other cost-conscious users of ≤200mm substrates), has reported its best-ever sales quarter and is currently doubling its Kalispell manufacturing capacity to meet the demand. "We've been seeing a steady increase in market interest and sales," says president Kevin Witt. "Most of these users are now focusing on capabilities they couldn't get before, like wafer-level packaging and More than Moore technologies," he adds.

Wafer-level packaging (WLP) has been used for some time with 300mm and larger substrates, but the equipment has not been available for 200mm, notes Witt. "ClassOne focuses specifically on the smaller-wafer markets," he adds. "At a very affordable price, we deliver the new technology and advanced 3D features they're looking for. For example, our Solstice line of multi-functional electroplating systems enables high-efficiency copper (Cu) through-silicon via (TSV), pillar, bump and barrier plating and other capabilities that WLP requires."

ClassOne says that many of the new buyers are interested in More than Moore (MtM) technologies to increase functionality while reducing cost per device, producing compound semiconductors, LEDs, MEMS, RF, Wi-Fi and a range of Internet of Things (IoT)-related sensors and other devices. The firm cites the combination of ≤200mm-specific tools, advanced capabilities and affordable pricing as the primary driver behind the current equipment-buying surge in emerging markets.

ClassOne Technology offers a selection of new-technology wet processing tools designed for 75-200mm wafer users, including three different models of Solstice electroplating systems for production and development as well as the Trident families of spin-rinse-dryers and spray solvent tools.

See related items:

ClassOne's Plating-Plus capability adds processing chambers to Solstice plating tool

Tags: ClassOne

Visit: www.classone.com/products

Share/Save/Bookmark
See Latest IssueRSS Feed

EVG