23 June 2016

Finetech's Lambda bonder enhances packaging capabilities at Lurie Nanofabrication Facility

Micro-assembly equipment maker Finetech of Berlin, Germany says that a Lambda bonding system has been installed in the Lurie Nanofabrication Facility (LNF) at the University of Michigan in Ann Arbor. The sub-micron accuracy bonder is designed to position and attach microelectronic or optoelectronic components on various substrates, including flex circuits, glass, silicon, ceramic, etc.

LNF selected the Lambda bonder to support packaging activities in its micro- and nanofabrication center. The 13,500ft2 facility is used by hundreds of students and researchers at the University of Michigan, other academic institutions, national labs and industry. The lab has expertise in combining technologies and materials within a single device, for example optical or mechanical sensors with integrated processing circuitry and on-board power generation.

The Lambda is a semi-automated bonding platform suitable for product and process development of photonics devices, sensors, LED bonding, micro-electro-mechanical systems (MEMS), flip-chip and micro-optics assembly. Bonding technologies supported by the system include thermocompression, thermosonic, ultrasonic, adhesives, curing and soldering (AuSn, C4, indium, eutectic).

"We chose the Finetech Lambda based on the system's process flexibility, accuracy, ease of use, and reliability - important factors in an active multi-user environment," says LNF's user services director Pilar Herrera-Fierro. "The sub-micron placement capability is critical for our research being done in areas such as silicon integrated circuits, optoelectronics, MEMS, Bio-MEMS and microfluidics."

Tags: LED packaging equipment

Visit: www.finetechusa.com/products/micro-assembly/fineplacerr-lambda.html

Visit: https://lnf.umich.edu