26 April 2018

StratEdge exhibiting high-temp and high-rel packages at CS ManTech and IMAPS HiTEC

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

StratEdge of San Diego, CA, USA (which designs and manufactures packages and provides chip assembly & test services for microwave, millimeter-wave and high-speed digital devices) is exhibiting its latest high-reliability package families in booth 112 at the International Conference on Compound Semiconductor Manufacturing Technology (CS ManTech 2018) in Austin, TX (7-9 May) and its latest packaging technology for high-temperature applications - including silicon, gallium arsenide (GaAs) and gallium nitride (GaN) devices - in booth 12 at the IMAPS International Conference on High Temperature Electronics (HiTEC 2018) in Albuquerque, NM (8-9 May).

“StratEdge packages have been popular for their heat-dissipating properties and high reliability for over 20 years, but with a continued emphasis on lowering power and pushing the capabilities of chips to deliver ever-higher frequencies, these packages are truly critical,” says president Tim Going. “Attending these shows enables us to work with engineers to build packages that enable proper functioning of their chips.”

See related items:

StratEdge displaying DC-63GHz packages at IMAPS Device Conference

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Visit: www.stratedge.com