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24 August 2018

MACOM showcasing optical and semiconductor components for cloud data-center, FTTx and 5G applications at CIOE

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

In booth #1A32 at the China International Optoelectronic Exposition (CIOE 2018) in Shenzhen Convention & Exhibition Center, China (5-8 September), MACOM Technology Solutions Holdings Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for RF, microwave, millimeter-wave and lightwave applications) is showcasing its product portfolio for 10 and 25Gbps passive optical network (PON), 5G optical networks, metro/long-haul and 100/200/400Gbps cloud data-center applications.

MACOM is highlighting how its broad portfolio is enabling high bandwidth and low latency, addressing the high-performance analog interfaces between electrical and optical domains and providing solutions aimed at meeting the demanding size, power and signal integrity requirements of high-speed next-generation PON, 5G and cloud data-center networks.

Highlights at the show include:

  • 10/25Gbps-PON ONU/OLT: total integrated circuit and optical solutions;
  • 5G wireless connectivity solutions: featuring MACOM’s 50Gbps PAM-4 chipset;
  • data-center solutions: featuring our 100Gb/s CWDM4, 1 DR1/FR1/LR1, and 100/200/400Gb/s PAM-4; and
  • long-haul and metro solutions: featuring MACOM’s 64 GBaud driver and TIA.

MACOM’s complete portfolio includes high-performance modulator drivers, transimpedance amplifiers (TIAs), clock/data recovery circuits (CDR), crosspoints, APD, PIN photodiodes, FP and DFB lasers, silicon photonics, mixed-signal PHYs and PAM-4 for enterprise and telecom optical systems operating up to 100/200/400Gbps and beyond.

Tags: M/A-COM

Visit: www.cioe.cn/en

Visit: www.macom.com

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