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28 August 2018

MRSI launches MRSI-H3LD die bonder for high-power diode laser market

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

MRSI Systems of North Billerica, MA, USA (which manufactures fully automated, high-precision eutectic and epoxy die bonding systems) is launching the MRSI-H3LD, a new 3μm high-speed die bonder, optimized for bonding large dies for high-power diode lasers used in photonics applications such as industrial lasers, optical fiber amplifications, lighting and sensors.

High-power diode lasers are critical components for multiple markets and have seen a significant, continual rise in adoption with the explosion in new applications, says the firm. The new MRSI-H3LD is equipped for speed with an ‘on-the-fly’ auto tool changer integrated on the bonding head for zero-time tool change-over with an ultrafast-ramp eutectic station for reduced cycle time. Combining both, the MRSI-H3LD demonstrates what is claimed to be the industry’s highest throughput for high-power diode laser die bonding.

“The new MRSI-H3LD product carries key technological building blocks from our field-proven flexible high-speed MRSI-HVM3 platform for industry-leading throughput, superior flexibility, and future-proven 3mm placement accuracy,” says MRSI’s VP of product management Dr Yi Qian. “It enables our high power diode laser and other photonics customers to scale up their business,” he adds.

The MRSI-H3LD has a placement accuracy of <3μm (±3s). The precision is achieved without sacrificing high speed or flexibility and it helps high-power diode laser manufacturing to achieve smaller offset between the front facets of laser diode and the front end surface of the submount. It is also equipped with self-leveling collets designed specially for large high-power laser dies to achieve co-planarity between two bonded interfaces.

MRSI Systems is exhibiting at the 20th China International Optoelectronic Expo (CIOE 2018) with its partner CYCAD Century Science and Technology (booth #1C66) in Shenzhen (5-8 September) and in booth #577 at the 44th European Conference on Optical Communications (ECOC 2018) in Rome, Italy (24-26 September).

See related items:

MRSI launches MRSI-HVM3P die bonder for new photonics applications

MRSI launches high-speed die bonder for photonics high-volume manufacturing

Tags: Die Bonder

Visit: www.cioe.cn/en

Visit: www.ecocexhibition.com

Visit: www.mrsisystems.com

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