, Molex showcasing next-gen optical solutions at OFC


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12 March 2018

Molex showcasing next-gen optical solutions at OFC

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

In booth 2512 at the Optical Networking and Communication Conference & Exhibition (OFC 2018) in San Diego (12-15 March), high-speed fiber-optic interconnect firm Molex Inc of Lisle, IL, USA is highlighting next-generation optical interconnect, wavelength management, optoelectronic and optical subsystem solutions for dynamic high-bandwidth telecoms and network infrastructure.

“High-speed optical transceivers, flexible and scalable optical transport products, compact connectors and fiber management are all vital capabilities to build high-bandwidth and high-density communication equipment to serve telecom, enterprise and hyperscale data centers,” says Doug Busch, VP & general manager, optical solutions at Molex.

Product technology highlights include:

  • Molex’s full portfolio of optical transceiver products, covering high-speed data-center, wireless xHaul and metro/aggregation optical networking applications with data rates up to 100Gbps.
  • Molex’s full portfolio of wavelength management products such as mux/demux, optical amplification, monitoring, switching and routing components, modules and subsystems.
  • MPO data-center optical solutions that support more efficient integration of high-performance networks and can eliminate redundant cabling when required.

Molex is also giving several public and private demonstrations, including:

  • Quad Small Form Factor Pluggable Double Density (QSFP-DD) system – This system showcases how the eight-lane electrical interface operates up to 25Gbps NRZ modulation or 56Gbps PAM-4, with feasibility of 112Gbps PAM-4, in support of the growth in future bandwidth needs.
  • 100G PAM-4 DWDM QSFP28 and 100G FR QSFP28 will demonstrate a 100G PAM-4 DWDM QSFP28 transceiver supporting data-center interconnects, as well as high-bandwidth wireless and wireline back-haul applications. To expand the reach of the DWDM transceiver, Molex is also showcasing the subsystem, which features automatic span loss detection, gain compensation and dispersion compensation. In compliance with 100G Lambda Multi-Source Agreement (MSA), Molex is demonstrating 100G FR QSFP28.
  • Mini-hybrid amplifier components for coherent signal boosting expand the mini-hybrid amplifier component offering with a series of new products that integrate more functions or in smaller form factors.

Molex is also participating in several speaking engagements and technical sessions:

  • The iNEMI Optoelectronics Technology Integration Group is hosting a one-day session coinciding with OFC on 12 March. During the working session, Molex’s Tom Marrapode is co-presenting on the status of the Singlemode Expanded Beam Connector Board Level Optical Interconnects Project that he leads.
  • Molex’s Ryan Yu joins other industry experts in a panel discussion on 5G wireless optical technologies.
  • Molex is jointly releasing a white paper at OFC with other QSFP-DD MSA members on the topics of QSFP-DD module thermal management strategies and capabilities in high-performance.

As a founder-promoter of the QSFP-DD and SFP-DD MSA, Molex invites attendees to preview the following demonstration in the Ethernet Alliance (EA) booth 2648 and OIF booth 5525:

  • SFP-DD MSA with Finisar is showcasing the new SFP-DD electrical interface, which comprises a module and cage/connector system targeting support up to 3.5W optical modules in an enterprise environment. The interface is designed to support two lanes that operate up to 25Gbps NRZ or 56Gbps PAM-4 per lane modulation, providing aggregate bandwidth of 50Gbps NRZ or 112Gbps PAM-4. In combination, an SFP-DD server port and QSFP-DD switch ports can effectively double port density in network applications. The SFP-DD port is backward compatible with legacy SFP and SFP+ style cables, modules and AOCs, and all new SFP-DD electrical interfaces.

Molex is joining fellow OIF members to demonstrate 112G Common Electrical Interface (CEI) solutions over a range of channel reaches and modulations. Live technology demonstrations featuring Molex solutions include:

  • CEI-56G VSR SerDes with Module demo incorporates multiple silicon supplier products operating over a 56Gbps PAM-4 VSR (chip-to-module) link as per the recently released CEI 4.0 specification. This full link demo uses Molex’s zQSFP, a CEI-56G-VSR interface, to electrically drive interoperating optical modules.
  • CEI-112G-LR SerDes: Passive Cables highlights the work by the OIF to define an interoperability standard for a serial electrical channel capable of driving 112Gbps per lane. This demonstration, which establishes early-stage feasibility for this topology, uses Molex’s QSFP-DD (double density) passive copper cable.

Tags: Molex silicon photonics

Visit: www.ofcconference.org/

Visit: www.molex.com/opticalsolutions

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