- News
20 March 2018
Molex and Innovium debut scalable solution for QSFP-DD migration at OCP Summit
© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.
High-speed fiber-optic interconnect firm Molex Inc of Lisle, IL, USA has come together with Silicon Valley-based Innovium (a provider of switching silicon solutions for data centers) to create a solution for customers migrating to QSFP-DD (Quad Small Form Factor – Double Density) 400G, showcased at the 2018 Open Compute Project (OCP) US Summit in San Jose, CA (20-21 March).
Molex recently launched its QSFP-DD Interconnect System and Cable Assemblies – designed to meet or exceed Ethernet, Fibre Channel and InfiniBand port-density requirements in high-speed enterprise, telecom and data networking equipment – to meet the rising demand for 100, 200 and 400Gbps networking solutions. Bringing together that system with Innovium’s TERALYNX switch chip means better performance and operational efficiencies for data-center customers.
“By leveraging the combined capabilities of Innovium’s TERALYNX 12.8Tbps switch chips and Molex QSFP-DD interconnect technology, we enable state-of-the-art next-generation data-center topologies,” says Molex’s group product manager Scott Sommers.
What is claimed to be the smallest 400Gbps Ethernet module providing the highest port bandwidth density, Molex’s QSFP-DD form factor features an 8-lane electrical interface that transmits up to 28Gbps NRZ (non-return-to-zero) or 56Gbps PAM-4 (4-level pulse amplitude modulation) for an aggregate bandwidth of up to 200Gbps NRZ or 400Gbps PAM-4, with an upgrade path toward 800Gbps PAM-4 using 112Gbps PAM-4. Molex’s QSFP-DD pluggable modules and connectors, cages and cables are backward compatible with existing QSFP+ interconnects for functionality across a wide variety of legacy and next-generation technologies and applications.
“Innovium’s TERALYNX was developed using innovative design techniques based on a ground-up architecture, delivering to data-center customers the highest-performance network switch silicon with superior buffering, latency and programmability,” says Amit Sanyal, Innovium’s VP of product management and marketing.
The TERALYNX product line delivers what is claimed to be the fastest and most scalable Ethernet switch silicon family with leading analytics, programmability, and power efficiency. TERALYNX is also claimed to be the first switch that achieves 12.8 Terabits per second (Tbps) performance in a single chip, while delivering robust tunneling, large buffers, line-rate programmability, best-in-class low-latency and breakthrough telemetry, resulting in a 6x advantage compared with alternatives. It includes broad support for 10/25/40/50/100/200/400GbE Ethernet standards that can be flexibly configured to deliver 128 ports of 100GbE, 64 ports of 200GbE or 32 ports of 400GbE in a single device.
QSFP-DD MSA releases QSFP-DD thermal white paper
QSFP-DD MSA Group releases 3.0 Hardware specification
Molex QSFP Optical transceivers 400G
www.molex.com/opticalsolutions
©2006-2020
Juno Publishing and Media Solutions Ltd. All rights reserved. Semiconductor
Today and the editorial material contained within it and related media is
the copyright of Juno Publishing and Media Solutions Ltd. Reproduction in
whole or part without permission from Juno Publishing and Media Solutions
Ltd is forbidden. In most cases, permission will be granted, if the magazine
and publisher are acknowledged.