, Picosun reports significant repeat sales of P-300F batch ALD production cluster tools

Temescal

ARM Purification

CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

Join our LinkedIn group!

Follow ST on Twitter

IQE

19 March 2018

Picosun reports significant repeat sales of P-300F batch ALD production cluster tools

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

Atomic layer deposition (ALD) thin-film technology firm Picosun of Espoo, Finland has reported significant repeat sales of P-300F production cluster tools to major US industrial customers.

Even if most common ICs are produced on 300mm silicon wafers, sub-300mm manufacturing is increasingly important, especially for existing and emerging non-silicon-based devices, notes Picosun. Wafer materials limited to maximum 200mm diameter such as silicon carbide (SiC), gallium nitride (GaN), aluminium nitride (AlN), sapphire, gallium arsenide (GaAs), lithium niobate (LiNbO3) and lithium tantalate (LiTaO3) offer benefits over silicon and enable a generation of new end-products, adds the firm.

Picosun’s core competence is cost-efficient, turn-key ALD production systems for the fast-growing More-than-Moore market, for which the P-300F is the flagship product. Specially designed to be run in cluster configuration under constant vacuum to enable fast and efficient high-throughput manufacturing, P-300F tools are connected together and operated in fully automatic mode with a central vacuum robot substrate handling and transfer system. The unique batch flipping mechanism in the P-300F is suitable for manufacturing lines where most of the process steps take place in a horizontal geometry. Cassette-to-cassette loading for up to 50-wafer batches of 200/150/100mm substrates, SEMI S2/S8 certification and a SECS/GEM option for factory host integration make the P-300F the optimal choice for demanding manufacturing needs for, for example, moisture barriers, capacitors and surface acoustic wave (SAW)/bulk acoustic wave (BAW) filters.

“The purity, uniformity and barrier properties of the ALD films deposited in these systems fulfil the strictest requirements of today’s semiconductor industries, making the Picosun P-300F the tool of choice for the forerunners of semiconductor manufacturing,” claims managing director Juhana Kostamo.

Tags: ALD

Visit: www.picosun.com

Share/Save/Bookmark
See Latest IssueRSS Feed

EVG