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17 October 2018

Cree signs long-term SiC wafer supply deal with leading power device maker

© Semiconductor Today Magazine / Juno PublishiPicture: Disco’s DAL7440 KABRA laser saw.

Cree Inc of Durham, NC, USA has signed a strategic long-term agreement to produce and supply its Wolfspeed silicon carbide (SiC) wafers to what it says is one of the world’s leading power device companies. Worth more than $85m, the agreement governs Cree’s supply of 150mm SiC bare and epitaxial wafers during what is described as a period of extraordinary growth and demand for silicon carbide power devices.

“Cree is committed to increasing and accelerating the adoption of silicon carbide-based solutions throughout the semiconductor industry,” says CEO Gregg Lowe. “This customer’s importance to the power device industry is well known, so partnering with a leading power semiconductor company such as this is another big step in that commitment,” he adds.

The supply agreement, to be fulfilled through a Cree distributor, enables silicon carbide applications in broad markets such as renewable energy and storage, electric vehicles, charging infrastructure, industrial power supplies, traction and variable speed drives.

“We are extremely pleased to help drive adoption of silicon carbide in even more applications,” says Lowe. “Cree is continuing to expand capacity to meet market demands.”

Tags: Wolfspeed Cree SiC Power electronics

Visit: www.wolfspeed.com

Visit: www.cree.com

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