MACOM showcasing high-speed analog PON and 100G data-center components at CIOE

MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for RF, microwave, millimeter-wave and lightwave applications) is showcasing its optoelectronic and photonic components in booth #1A32 at the China International Optoelectronic Exposition (CIOE 2019) in Shenzhen Convention and Exhibition Center (4-7 September).

At CIOE 2019 MACOM is explaining its portfolio of components is enabling high bandwidth and low latency, addressing the high-performance analog interfaces between electrical and optical domains, and providing solutions aimed at meeting the demanding size, power and signal integrity requirements of high-speed next-generation PON, wireless and wireline telecoms, and cloud data-center networks.

The firm’s complete and robust portfolio includes high-performance modulator drivers, transimpedance amplifiers (TIAs), clock/data recovery circuits (CDR), crosspoint switches, avalanche photodiodes (APDs), PIN photodiodes, Fabry-Perot (FP) and distributed feedback (DFB) lasers, mixed-signal PHYs and PAM-4 for enterprise and telecom optical systems operating up to 100/200/400Gbps and beyond.

Specifically, at CIOE 2019 MACOM is highlighting the following:

PON components: 10/25Gbps-PON ONU/OLT;
Telecom portfolio: 25Gbps CDR, TIA and driver portfolios, 25Gbps FP lasers, APD photodiodes and 50Gbps PAM-4 chipset;
Data-center components: 100Gbps CWDM4, DR1/FR1/LR1 and 100/200/400Gbps PAM-4; and
Long-haul and metro components: 64GBaud driver and TIA.

Tags: M/A-COM

Visit: www.cioe.cn/en

Visit: www.macom.com