MRSI-H/HVM-Series die bonder accuracy improved from 3μm to 1.5μm

Mycronic Group’s MRSI Systems of North Billerica, MA, USA (which makes fully automated, high-precision eutectic and epoxy die bonding systems) has announced the latest advance in its MRSI-H/HVM-series product line. Testing placement accuracy using industry-standard glass die reference samples shows enhancement from ±3μm (at 3 sigma) to ±1.5μm (at 3 sigma). Beginning with shipments from 1 October, the product names will be MRSI-H and MRSI-HVM (formerly known as MRSI-H3 and MRSI-HVM3).

MRSI says that its trademark of high-speed and high flexibility remains uncompromised with the improved accuracy. Users now have options to design products for higher-density and higher-speed parts in miniature packages. This is critical for advanced products such as 400G+ photonics devices for data centers and backbone networks, as well as complex DFB/WDM/EML TO-can TOSA/ROSA devices for 5G wireless applications.

“With proven success in the field and a large worldwide installation base, these MRSI-H/HVM-series products have demonstrated their ability to deliver ultra-precision, high-speed and high-flexibility concurrently,” says Dr Yi Qian, VP of marketing. “This is critical for our customers’ high-mix high-volume photonics manufacturing,” he adds.

MRSI is attending the China International Optoelectronic Exposition (CIOE 2019) in Shenzhen (4-7 September).

See related items:

MRSI launches MRSI-HVM3P die bonder for new photonics applications

MRSI launches high-speed die bonder for photonics high-volume manufacturing

Tags: Die Bonder

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