DISCO completes construction of new US head office in Silicon Valley

Tokyo-based equipment maker DISCO Corp – which makes semiconductor manufacturing equipment including chemical mechanical polishing (CMP) systems and laser-based ingot slicing equipment and processes for silicon carbide (SiC) – says that DISCO HI-TEC America Inc has completed construction of its new head office/sales & service office in Silicon Valley for the purpose of strengthening the organization’s ability to respond to customer requirements. The new office building at 5921 Optical Court in San Jose, CA 95138, USA has a floor area about three times larger than the existing building in Santa Clara, CA (6200m2, rather than 2000m2) and processing space about 3.5 times larger (including a cleanroom). Construction costs (site, building acquisition and renovation) totaled $21m.

DISCO says that, with advances in the Internet of Things (IoT), medical, communications and self-driving technology, the development needs for semiconductors and electronic components is increasing, causing the number of requests from manufacturers for processing verification and contracted processing in the device development stages to increase. Thus, it was essential for DISCO to further enhance its services.

DISCO HI-TEC America Inc provides sales and maintenance of precision processing equipment, precision processing tools and related equipment, applications support, and contracted processing services.

Relocation to the new office building is scheduled to be completed in early July.

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Tags: SiC

Visit: www.disco.co.jp