MACOM and CIG demo first 200G optical module based on low-cost, low-power analog chipset

At the Optical Networking and Communication Conference & Exhibition (OFC 2019) in San Diego (5-7 March), MACOM Technology Solutions Inc of Lowell, MA, USA (which makes semiconductors, components and subassemblies for analog RF, microwave, millimeter-wave and photonic applications) gave a live demonstration of a complete 200G optical module solution designed in collaboration with Shanghai-based Cambridge Industries Group (CIG, a ODM/JDM/EMS supplier for the ICT industry). The new 200G (4 x 50Gbps) QSFP module was developed by CIG leveraging a high-performance analog chipset from MACOM, and is optimized for volume-scale deployment in high-density cloud data-center links.

Targeted for faster, more power-efficient and lower-cost optical interconnects, the solution is provides a pathway to 200G throughput speeds using analog chipsets. MACOM’s fully analog transmit & receive chipset consists of the MAOM-38053 four-channel transmit CDR with integrated EML driver and, on the receive side, MACOM’s BSP56B photodetectors, a MATA-03819 quad TIA and the MASC-38040 four-channel receive CDR.

“MACOM is applying its expertise and market leadership in 25Gbps and 100Gbps solutions to 50Gbps PAM-4 applications and specifically to 200G QSFP and 2 x 200G OSFP/QSFP-DD modules to bring the benefits of low-power and low-latency solutions to cloud data centers,” says Marek Tlalka, senior director of marketing, High-Performance Analog, at MACOM. “We are excited to collaborate with CIG to deliver the industry’s first 200G optical module based fully on a low-cost and low-power analog chipset,” he adds.

“CIG has again advanced its leadership in 200G QSFP module applications with MACOM’s low-cost, lower-power, fully analog technology for volume production in our highly automated production lines,” says CIG’s VP of sales & marketing Michael Xin. “This breakthrough affirms our commitment to advancing optical module technology and enabling a new ecosystem for analog technology in data-center interconnects.”

All of the MACOM products highlighted in the 200G module demonstrations are sampling to customers now, with production availability targeted for second-half 2019.

Tags: Optical communications M/A-COM

Visit: www.macom.com/opto

Visit: www.cigtech.com/optical-sub-assemblies