DISCO improves throughput and communication support for semi-automatic dicing saws

Tokyo-based equipment maker DISCO Corp – which makes semiconductor manufacturing equipment including chemical mechanical polishing (CMP) systems and laser-based ingot slicing equipment and processes for silicon carbide (SiC) – has developed the DAD3351 semi-automatic dicing saw for 200mm-diameter wafers, a model with 5% greater unit per hour (UPH) throughput and 10% smaller footprint. Additionally, the DAD3361 and DAD3431 models have also been developed. All will go on sales release in January, alongside the existing model DAD3350.

With the development of the three new models, DISCO has also completed a transition for all nine semi-automatic dicing saw models, with improved productivity and communication support in all models.

Model change for all semi-automatic dicing saws

For mass production, multiple units must be installed and simultaneously operated in parallel due to the time needed to process difficult-to-cut materials such as glass and ceramics used for sensors and passive components. Many production sites therefore adopt manual dicing saws with simple functions, and a small group of operators control them. However, communication functions were limited in existing models, making it difficult to control them centrally. There was therefore demand for communication support enabling timely control of multiple dicing saws, says DISCO. A model transition was hence undertaken for all nine existing semi-automatic dicing saw models.

DAD3351 product features

The existing DAD3350 semi-automatic dicing saw is a best-selling model that flexibly supports a wide range of workpieces and has been delivered to many companies worldwide, says DISCO. The newly developed DAD3351 has inherited its features, with a high-rigidity bridge-type frame for the spindle axis (which can withstand high-load processing) and high extensibility to support various options and user-specified specifications. Accompanying the model change carried out for all nine semi-automatic dicing saws, the following features have been improved.

UPH increased by 5% - By increasing the X-axis speed from 600mm/s to 1000mm/s and the Y-axis speed from 200mm/s to 400mm/s (through an improvement in motor performance) and by optimizing the parameters, UPH has been improved by 5% compared with the DAD3350.
Small footprint - The footprint has been reduced by 10% (to 880mm x 1000mm = 0.88m2) compared with the DAD3350 (900mm x 1050mm = 0.95m2).

Major components of model change

Enhanced communication support and software support functions through installation of a new type of PC
- supports the SECS/GEM SEMI Equipment Communications Standard and Generic Model for Communication and Control of Manufacturing Equipment (optional);
- supports a communication network that enables batch control of multiple items of equipment.
Productivity improvement through installation of a new type of non-contact setup
- reduces the time necessary to complete measurement of blade height against the processing chuck table’s upper surface by 74%;
- improves processing quality through a stable cut depth for the workpiece by increasing measurement accuracy.
Control performance improvement for X-, Y- and Z-axis
- possible to control the processing axis precisely through the adoption of servo motors for each axis and high-speed communication support;
- improves processing quality by achieving a stable cut depth for the workpiece through high-precision height control.
Innovation of standard software
- adopts Windows 10 as the operating system (OS);
- improves user-interface of the standard software.

The DAD324, DAD3351, and DAD3651 are being exhibited at SEMICON Japan 2019 in Tokyo (11–13 December)

Tags: SiC

Visit: www.disco.co.jp