Soitec and Applied Materials to jointly develop silicon carbide substrates using Smart Cut technology

Engineered substrate manufacturer Soitec of Bernin, near Grenoble, France has announced a joint development program with semiconductor equipment maker Applied Materials Inc of Santa Clara, CA, USA on silicon carbide substrates.

Demand for SiC-based chips has been rising, particularly in electric vehicles (EVs), telecoms and industrial applications. However, adoption has been limited due to challenges related to supply, yield and cost of silicon carbide substrates. Soitec says that it will be working with Applied Materials to develop substrates that can overcome these challenges.

The development program will combine Soitec’s expertise in engineered substrates with that of Applied Materials in materials engineering solutions. Soitec will leverage its proprietary Smart Cut technology - currently in use for the manufacture of silicon-on-insulator (SOI) products widely adopted by chip makers. Applied Materials will contribute process technology and equipment expertise.

Under the development program, the firms will install a silicon carbide engineered substrate pilot line at the Substrate Innovation Center located at micro/nanotechnology R&D center CEA-Leti in Grenoble, France. The line is expected to be operational by first-half 2020, with the goal of producing silicon carbide wafer samples using Soitec’s Smart Cut technology in second-half 2020.

“Soitec’s Smart Cut technology and 30 years of experience, together with Applied Materials’ great leadership in materials engineering, can enable the development of a robust technology and boost the silicon carbide supply chain,” believes Thomas Piliszczuk, executive VP of Strategic Office at Soitec.

“With its broad portfolio and deep expertise, Applied Materials is best positioned to help the power electronics industry overcome the toughest technology challenges,” reckons Steve Ghanayem, senior VP of New Markets and Alliances at Applied Materials.

“Electric vehicles are a key focus for Audi. The future of mobility will be electric – based on technology innovations beginning at the semiconductor material and substrate level,” comments Berthold Hellenthal, head of Competence Center Electronics and Semiconductors and the Semiconductor Strategy at Audi AG. “Silicon carbide can enable higher power density and better efficiency semiconductors in electric vehicles. We are pleased to see Soitec and Applied Materials working together to advance this technology.”

See related items:

Leti and Soitec launch Substrate Innovation Center as part of latest five-year partnership

Tags: Soitec engineered substrates Applied Materials Leti

Visit: www.appliedmaterials.com

Visit: www.soitec.com