ARM Purification

CLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIACLICK HERE: free registration for Semiconductor Today and Semiconductor Today ASIA

Join our LinkedIn group!

Follow ST on Twitter


30 September 2019

Aixtron presents next-gen AIX G5 WW C SiC epi production system

At the International Conference on Silicon Carbide and Related Materials (ICSCRM 2019) in Kyoto, Japan (29 September – 4 October), deposition equipment maker Aixtron SE of Herzogenrath, near Aachen, Germany has presented its new AIX G5 WW C system for the high-volume production of next-generation silicon carbide (SiC) epitaxial wafers. Aixtron says it has already obtained orders from several customers, while multiple performance demonstrations to additional customers have been addressed successfully.

“We expect the demand for SiC power electronics to grow rapidly in the coming years. By 2023, the market for power electronic devices is forecasted to have a volume of approximately US$10bn+, of which US$1-2bn will be made of highly efficient SiC devices,” says president Dr Felix Grawert. “Our cost-efficient epi deposition tool supports SiC device makers in the race for gaining share from silicon-based power electronic devices,” he adds. “With this, Aixtron is backing the global trends towards green energy in the fields of electro-mobility, wind and solar energy as well as in highly efficient motor drives.”

Based on Aixtron’s proven Planetary Reactor platform and equipped with a cassette-to-cassette (C2C) wafer handling system, the fully automated AIX G5 WW C provides what is claimed to be the largest batch capacity and highest throughput in the industry. Initially offering an 8x6-inch configuration with single-wafer control, the system addresses the cost challenge in SiC device manufacturing: specifically, the AIX G5 WW C brings the epi costs of SiC devices to a minimum while maintaining production quality. Furthermore, it is compatible with fabs in the silicon industry allowing the integration of SiC epiwafer manufacturing into existing facilities and production lines.

“The AIX G5 WW C not only incorporates the automated cassette-to-cassette wafer loading for high-temperature wafer transfer, but also considers the demanding requirements of our customers in the semiconductor industry,” notes Dr Frank Wischmeyer, VP business development & marketing Power Electronics.

Tags: Aixtron SiC

Visit: www.icscrm2019.org

Visit: www.aixtron.com

See Latest IssueRSS Feed