SFP-DD MSA releases first management interface spec

The Small Form Factor Pluggable Double Density (SFP-DD) Multi Source Agreement (MSA) Group is has released its first management interface specification (MIS). The SFP-DD MIS may be used by 2-lane pluggable modules with host to module management communication based on a two-wire interface (TWI).

Developed to allow host and module software implementers to utilize a common code base across a variety of form factors, the SFP-DD MIS provides a set of core functionality that all modules must implement and a set of optional features whose implementation is advertised in the module memory map. This approach allows host software implementers to read and react to optional module capability advertisements while ensuring interoperability with all modules at a basic level.

SFP-DD MSA promoters include Alibaba, Broadcom, Cisco, Dell EMC, Finisar, HPE, Huawei, Intel, Juniper Networks, Lumentum, Mellanox, Molex and TE Connectivity. Contributors include Accelink, Amphenol, AOI, Foxconn Interconnect Technology, Fourte, Genesis, Hisense, Infinera, Innolight, Maxim Integrated, Multilane, Nokia, Senko, Source Photonics, US Conec and ZTE.

A characteristic common to all SFP-DD MIS-compliant modules is that management data is transferred over a TWI, using a 256-byte addressable memory window, with mechanisms to dynamically page data of a much larger management memory space into the upper half of the host-addressable memory window. SFP-DD MIS-compliant pluggable modules are 2-lane module form factors.

“With this new release, the MIS will enable the adoption of the SFP-DD form factor as the next generation of SFP-DD modules, connectors and cage systems,” says Scott Sommers, founding member & MSA chairman.

Many MSA members are demonstrating SFP-DD at the European Conference on Optical Communication (ECOC 2019) in Dublin, Ireland (23-25 September).

See related items:

SFP-DD MSA releases spec for high-speed, high-density interface

Tags: SFP

Visit: www.sfp-dd.com