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5 December 2006


NSTR opts for BedeScan X-ray Defect Detection and Inspection system

Bede X-ray Metrology of Durham, UK will ship a BedeScan Defect Detection and Inspection System to Nippon Steel Technoresearch Corporation (NSTR), Japan at the end of December.  With its patented non-destructive X-ray Diffraction Imaging technique (XRDI), the system will be used to look at surface and buried crystallographic defects in Silicon and Silicon Carbide (SiC) wafers.

Tomiyoshi Masuda, president of NSTR said: “We chose the BedeScan system because of its ability to provide high resolution images of crucial defects in semiconductor wafers.  The advantage of the BedeScan is that it allows us to better visualize buried defects in wafers, as well as those on the surface.  Such defects may go undetected with traditional inspection methods that have been used in the past.  In addition, the system also allows us to look at new classes of wafer edge defects which can lead to device failure.”

Jim Polasik, Chief Operating Officer, Bede X-ray Metrology, said: “The BedeScan is addressing the problems being encountered at the new technology nodes, including the monitoring of non-visual buried defects to prevent wafer breakage during ultra fast anneal.  We are now seeing that its inspection capability on both bare and patterned 300mm wafers is challenging conventional semiconductor wafer inspection systems, and delivering substantial savings.”