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10 July 2006


Aixtron takes further steps into mainstream semiconductor processing

Best known for its MOCVD range of systems for compound semiconductor fabrication, Aixtron AG has taken another step into mainstream silicon (Si) processing with the first sale of its combined Genus 300 mm Atomic Layer Deposition (ALD) StrataGem and Atomic Vapor Deposition (AVD) technologies. The order was placed by an unnamed Asian memory chip manufacturer, and installation at the customer’s purpose-built 300 mm R&D fab will begin Q3, 2006.

Initially, the system will be used for:

  • Evaluation of various high-k dielectrics and metal gate materials for large-scale production purposes
  • Integration of those materials into high-k gate stacks & advanced DRAM capacitors
  • Optimization of DRAM and CMOS device structures for Sub-45nm.

Aixtron gained ALD and AVD technologies when it merged with Genus a year ago. According to Aixtron, ALD and AVD can overcome many of the limitations of current film deposition techniques. The company sees the technology as a driving force into mainstream/HV semiconductor processing.

William W. R. Elder, the member of Aixtron’s Executive Board responsible for all of the company’s silicon business interests, said: “Many of Genus' primary customers are major chip manufacturers in the memory (DRAM and FLASH) segment of the semiconductor industry. The process modules are based on a patented process chamber concept and have achieved a leading position for the deposition of tungsten silicide (WSix) and high-k materials, primarily used in memory and capacitor applications.

With ALD, AVD technologies and the company’s core tungsten silicide CVD platform, we are now able to offer our customers a full and comprehensive portfolio of semiconductor process technologies.”

Visit: http://www.aixtron.com