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16 April 2007


StratEdge launches packages using beryllium oxide for power devices

At the RF & Hyper Trade Show in Paris, France at the end of March, StratEdge of San Diego, CA, USA, which designs and produces packages for microwave, millimetre-wave, and high-speed digital devices, released its Power Package Series (also to be featured at the MTT-S show in Honolulu, Hawaii, 5-7 June). The new series can be used in silicon, silicon carbide, gallium nitride, and other applications for power integrated circuits. Thermally conductive beryllium oxide (BeO) ceramic gives the packages excellent thermal properties, the firm claims. The packages also incorporate copper composite bases for enhanced thermal dissipation.

“We came up with a new hermetic package construction with improved reliability that still fits the industry-standard outlines,” says senior applications engineer Jerry Carter. Hermetic packages are sealed with metal or ceramic lids that have gold-tin solder preforms. The non-hermetic version is sealed with cup-shaped ceramic or liquid crystal polymer lids with B-stage epoxy preforms.  

“The way the packages are constructed is nearly identical to some of our existing package families,” adds president Tim Going. “The manufacturing technology is very mature and stable.”