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31 May 2007


TriQuint launches packaged versions of RF circuits for digital radio and sat-coms

At next week’s 2007 IEEE MTT-S International Microwave Symposium in Hawaii, TriQuint Semiconductor of Hillsboro, OR, USA is debuting the first three devices in its new packaged Multi-Function Circuit (MFC) GaAs IC family, developed for point-to-point (PTP) digital radio and K-band satellite communications applications.

The new TGC4402-SM, TGC4403-SM and TGC4405-SM devices are extensions of the die-level TGC4402, TGC4403 and TGC4405 products launched at last November’s Electronica 2006 trade fair in Munich, Germany , but are now provided in industry-standard 4mm x 4mm x 0.9mm packages (offering greater manufacturing flexibility, the firm says).
The new MFC products embody TriQuint’s new three-part vision for simplifying next-generation connectivity (as detailed by its Networks Business Unit on 21 May), which includes offering more integrated devices for size- and cost-constrained applications and providing more high-frequency packaged product options, says TriQuint Networks VP Brian Balut. Packaging gives users greater access to the firm’s portfolio of die-level designs, which also ties to easier product access (“the third part of our vision for simplifying connectivity,” Balut adds).

“Packaging appeals to a larger number of manufacturers by offering more choices and greater flexibility,” says product marketing manager Mike Tessaro. “Some find that packaged devices enable more design control,” he adds.

Manufacturers can therefore now choose from either a highly integrated module or separate discrete component functions to suit individual assembly and PCB layout preferences. More choices lead to easier manufacturing and faster design turns, TriQuint says. For example, packaged products enable manufacturers that are not equipped to handle die-level devices to use standard pick-and-place assembly techniques, which are less costly than working with ESD-sensitive die; also, packaged devices provide additional cost and time-to-market advantages by eliminating the expense and delays of using a third-party packaging vendor).

The three newly packaged products address OEM needs for frequency upconversion (amplification) in the transmit (Tx) and local oscillator chains for digital radio and satellite communications systems.

  • The TGC4403-SM is a millimeter-wave frequency doubler operating at 16-30GHz that includes an output buffer amplifier that delivers 20dBm (typical) output RF power and 18dB of gain. The high conversion gain allows operation over a -5dBm to +5 dBm input power range while consuming only 150mA of quiescent current from a +5V supply.  
  • The TGC4405-SM is a single-balanced upconverter that features an integrated local oscillator (LO) frequency doubler and output post-amplifier, providing typical conversion gain of 13dB across the 17-27GHz RF band.
  • The TGC4402-SM single-balanced passive product is an upconverting mixer operating at 18-26GHz for designs that require no integrated LO doubler or output amplifier.

The TGC4405-SM and TGC4402-SM both have single-ended signal ports and no need for external RF, LO and IF baluns (as they are integrated).

Also, for base-station, point-to-point radio and general-purpose amplifier applications, TriQuint is now sampling the new TGF2960-SD (0.5W, nominal) and TGF2961-SD (1.0W, nominal) heterojunction field-effect transistor (HFET) products, available in industry-standard packages to complement the firm’s existing range of die-level discrete products. Likewise, availability in packaged form should lead to increased utilization of the devices across a wider range of applications, reckons TriQuint.

“Equipment and radio designers strive to find cost-effective, high-performance components that may be utilized for multiple functions in their designs,” says product marketing director Dan Green. “Customers like to be able to reuse a component in a design or across multiple designs and applications. Packaged HFET power discrete devices fill this role and work to lower bill-of-material component count and overall product cost,” he adds. “Packaged HFET power discrete devices are well suited for use throughout the RF and IF signal paths as gain blocks, driver and power stages.”

*TriQuint’s new packaged devices are detailed in the firm’s first Product Selection Guide, which aims to simplify design and purchasing for RF engineers (available from 5 June, supporting the third part of the firm’s vision for simplifying network connectivity). The guide covers RF applications in wireless base stations, WiFi, WiMAX, GPS, cellular, digital cable, satellite and optical communications systems.

See related items:

TriQuint unveils ‘RF vision’ for simplifying connectivity in next-generation wireless networks

TriQuint results boosted by new top-five handset customer