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15 October 2007


Cree launches 100mm Zero Micropipe SiC

Cree Inc of Durham, NC, USA has announced the commercial release of its Zero Micropipe (ZMP) 100mm, n-type silicon carbide substrates.

The firm says that micropipes have been present in nearly all SiC wafers manufactured and sold by commercial substrate vendors until recently. The crystalline defects can not only decrease the number of usable electronic devices produced per wafer but also negatively affect the performance parameters of each device produced. Through previous R&D at Cree, partially funded by the US Army and DARPA, the density of these defects has been dramatically reduced.

“The transition to production of Cree’s 100mm ZMP substrate technology is an important step to the wide-scale industry adoption of SiC as the material of choice for high-power switching components,” claims Cengiz Balkas, VP and general manager for materials. “The integration of this technology across other Cree product lines is expected to accelerate the adoption of SiC as a high-volume, production-ready material platform.”

See related items:

Cree demos 100mm zero-micropipe SiC substrates

Cree to acquire SiC substrates manufacturer Intrinsic Semiconductor

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